Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 22 MB |
Processor ARK ID | 193394 |
Processor model | 4216 |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'19 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 193394 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | No |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 79 °C |
Packaging data | |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package weight | 201 g |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package weight | 201 g |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 22 MB |
Processor ARK ID | 193394 |
Processor model | 4216 |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'19 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 193394 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | No |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 79 °C |
Packaging data | |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package weight | 201 g |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package weight | 201 g |
Other features | |
Maximum internal memory | 1 TB |
Save £403.27
Processor | |
---|---|
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 22 MB |
Processor ARK ID | 193753 |
Processor model | W-3245 |
Processor threads | 32 |
System bus rate | 8 GT/s |
Processor boost frequency | 4.4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon W |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX-512 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'19 |
Intel Virtualization Technology (VT-x) | Yes |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 193753 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX-512 |
Scalability | 1S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | No |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.6 GHz |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 77 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 22 MB |
Processor ARK ID | 193753 |
Processor model | W-3245 |
Processor threads | 32 |
System bus rate | 8 GT/s |
Processor boost frequency | 4.4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon W |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX-512 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'19 |
Intel Virtualization Technology (VT-x) | Yes |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 193753 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX-512 |
Scalability | 1S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | No |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.6 GHz |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 77 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Save £977.28
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7302P |
Processor threads | 32 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.3 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7302P |
Processor threads | 32 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.3 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £198.57
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22 MB |
Processor ARK ID | 199347 |
Processor model | 6226R |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.9 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 150 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199347 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 85 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22 MB |
Processor ARK ID | 199347 |
Processor model | 6226R |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.9 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 150 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199347 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 85 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Save £484.86
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor ARK ID | 199353 |
Processor model | 6246R |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.1 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199353 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 75 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor ARK ID | 199353 |
Processor model | 6246R |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.1 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199353 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 75 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Save £1,264.67
Processor | |
---|---|
Processor generation | AMD Ryzen 5000 Series |
Processor base frequency | 3.4 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5950X |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.9 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | AMD Ryzen 5000 Series |
Processor base frequency | 3.4 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5950X |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.9 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £171.63
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7313 |
Processor threads | 32 |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 180 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7313 |
Processor threads | 32 |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 180 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £244.60
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 36 MB |
Processor ARK ID | 212457 |
Processor model | 6346 |
Processor threads | 32 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 4 |
High priority core frequency | 3.2 GHz |
Low priority cores | 12 |
Low priority core frequency | 3 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212457 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 78 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 36 MB |
Processor ARK ID | 212457 |
Processor model | 6346 |
Processor threads | 32 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 4 |
High priority core frequency | 3.2 GHz |
Low priority cores | 12 |
Low priority core frequency | 3 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212457 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 78 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £590.88
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £615.42
Processor | |
---|---|
Processor generation | 12th gen Intel® Core™ i9 |
Processor manufacturer | Intel |
Processor codename | Alder Lake |
Memory bandwidth supported by processor (max) | 76.8 GB/s |
Processor cache | 30 MB |
Processor ARK ID | 134600 |
Processor model | i9-12900KF |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Bus type | DMI4 |
Component for | PC |
Processor family | Intel® Core™ i9 |
Processor cores | 16 |
Box | Yes |
Processor socket | LGA 1700 |
Processor cache type | Smart Cache |
Performance cores | 8 |
Efficient cores | 8 |
Performance-core boost frequency | 5.1 GHz |
Performance-core base frequency | 3.2 GHz |
Efficient-core boost frequency | 3.9 GHz |
Efficient-core base frequency | 2.4 GHz |
Processor base power | 125 W |
Maximum turbo power | 241 W |
Maximum number of DMI lanes | 8 |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
Memory bandwidth supported by processor (max) | 76.8 GB/s |
Memory channels | Dual-channel |
Memory bandwidth (max) | 76.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Technical details | |
Thermal solution specification | PCG 2020A |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'21 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 20 |
Processor package size | 45 x 37.5 mm |
Processor ARK ID | 134600 |
Thermal solution specification | PCG 2020A |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G167599 |
Use conditions | PC/Client/Tablet |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Intel® Thread Director | Yes |
Intel® Standard Manageability (ISM) | Yes |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 45 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 12th gen Intel® Core™ i9 |
Processor manufacturer | Intel |
Processor codename | Alder Lake |
Memory bandwidth supported by processor (max) | 76.8 GB/s |
Processor cache | 30 MB |
Processor ARK ID | 134600 |
Processor model | i9-12900KF |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Bus type | DMI4 |
Component for | PC |
Processor family | Intel® Core™ i9 |
Processor cores | 16 |
Box | Yes |
Processor socket | LGA 1700 |
Processor cache type | Smart Cache |
Performance cores | 8 |
Efficient cores | 8 |
Performance-core boost frequency | 5.1 GHz |
Performance-core base frequency | 3.2 GHz |
Efficient-core boost frequency | 3.9 GHz |
Efficient-core base frequency | 2.4 GHz |
Processor base power | 125 W |
Maximum turbo power | 241 W |
Maximum number of DMI lanes | 8 |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
Memory bandwidth supported by processor (max) | 76.8 GB/s |
Memory channels | Dual-channel |
Memory bandwidth (max) | 76.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Technical details | |
Thermal solution specification | PCG 2020A |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'21 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 20 |
Processor package size | 45 x 37.5 mm |
Processor ARK ID | 134600 |
Thermal solution specification | PCG 2020A |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G167599 |
Use conditions | PC/Client/Tablet |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Intel® Thread Director | Yes |
Intel® Standard Manageability (ISM) | Yes |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 45 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £192.28
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor ARK ID | 215269 |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 135 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2667 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215269 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 8 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 86 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor ARK ID | 215269 |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 135 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2667 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215269 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 8 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 86 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £670.28
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 4 GHz |
Processor manufacturer | AMD |
Cooler included | Yes |
Thermal Design Power (TDP) | 280 W |
Processor cache | 64 MB |
Processor model | 5955WX |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket sWRX8 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Compatible operating systems | Windows 11/10 x64 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Compatible operating systems | Windows 11/10 x64 |
Market segment | Desktop |
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 4 GHz |
Processor manufacturer | AMD |
Cooler included | Yes |
Thermal Design Power (TDP) | 280 W |
Processor cache | 64 MB |
Processor model | 5955WX |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket sWRX8 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Compatible operating systems | Windows 11/10 x64 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Compatible operating systems | Windows 11/10 x64 |
Market segment | Desktop |
Save £813.61
Save £6.18