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Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £1,053.57
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor ARK ID | 199351 |
Processor model | 6248R |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199351 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 75 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor ARK ID | 199351 |
Processor model | 6248R |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 199351 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | Yes |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 75 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Other features | |
Maximum internal memory | 1 TB |
Save £1,167.18
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 165 W |
Processor cache | 36 MB |
Processor ARK ID | 215271 |
Processor model | 5318Y |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
High priority cores | 8 |
High priority core frequency | 2.3 GHz |
Low priority cores | 16 |
Low priority core frequency | 1.8 GHz |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215271 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 87 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 165 W |
Processor cache | 36 MB |
Processor ARK ID | 215271 |
Processor model | 5318Y |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
High priority cores | 8 |
High priority core frequency | 2.3 GHz |
Low priority cores | 16 |
Low priority core frequency | 1.8 GHz |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215271 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 87 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £542.67
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 230 W |
Processor cache | 36 MB |
Processor ARK ID | 215276 |
Processor model | 6342 |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 24 |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.9 GHz |
Low priority cores | 12 |
Low priority core frequency | 2.6 GHz |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 230 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 230 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 230 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215276 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 81 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 230 W |
Processor cache | 36 MB |
Processor ARK ID | 215276 |
Processor model | 6342 |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 24 |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.9 GHz |
Low priority cores | 12 |
Low priority core frequency | 2.6 GHz |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 230 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 230 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 230 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215276 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 81 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £1,365.90
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £928.80
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | No |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 5000 WX-Series |
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | No |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Save £698.92
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 7000 WX-Series |
Processor base frequency | 4.2 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 350 W |
Processor cache | 128 MB |
Processor model | 7965WX |
Processor threads | 48 |
Processor boost frequency | 5.3 GHz |
Processor lithography | 5 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor socket | Socket sTR5 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR5-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 350 W |
Technical details | |
PCI Express slots version | 5.0 |
Compatible operating systems | Windows 11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
Thermal Design Power (TDP) | 350 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 350 W |
PCI Express slots version | 5.0 |
Compatible operating systems | Windows 11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
Market segment | Desktop |
Processor | |
---|---|
Processor generation | AMD Ryzen Threadripper PRO 7000 WX-Series |
Processor base frequency | 4.2 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 350 W |
Processor cache | 128 MB |
Processor model | 7965WX |
Processor threads | 48 |
Processor boost frequency | 5.3 GHz |
Processor lithography | 5 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor socket | Socket sTR5 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR5-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 350 W |
Technical details | |
PCI Express slots version | 5.0 |
Compatible operating systems | Windows 11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
Thermal Design Power (TDP) | 350 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 350 W |
PCI Express slots version | 5.0 |
Compatible operating systems | Windows 11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
Market segment | Desktop |
Save £1,286.23
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402P |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402P |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £150.25
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £250.49
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7352 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7352 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £272.21
Save £6.18