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Processor Processor base frequency 3.2 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 205 W Processor cache 22 MB Processor ARK ID 193753 Processor model W-3245 Processor threads 32 System bus rate 8 GT/s Processor boost frequency 4.4 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel Xeon W Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets AVX-512 Scalability 1S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'19 Intel Virtualization Technology (VT-x) Yes Number of UPI links 0 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Bus speed 8 GT/s Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 76mm x 56.5mm Processor ARK ID 193753 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets AVX-512 Scalability 1S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 Yes Intel® Speed Shift Technology Yes Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Boot Guard Yes Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported No Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) No Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology No Intel Speed Select Technology (SST) No Intel® Turbo Boost Max Technology 3.0 frequency 4.6 GHz Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 77 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB Intel Xeon W-3245 processor 3.2 GHz 22 MB Tray£2,061.30Processor Processor base frequency 3.2 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 205 W Processor cache 22 MB Processor ARK ID 193753 Processor model W-3245 Processor threads 32 System bus rate 8 GT/s Processor boost frequency 4.4 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel Xeon W Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets AVX-512 Scalability 1S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'19 Intel Virtualization Technology (VT-x) Yes Number of UPI links 0 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Bus speed 8 GT/s Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 76mm x 56.5mm Processor ARK ID 193753 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets AVX-512 Scalability 1S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 Yes Intel® Speed Shift Technology Yes Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Boot Guard Yes Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported No Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) No Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology No Intel Speed Select Technology (SST) No Intel® Turbo Boost Max Technology 3.0 frequency 4.6 GHz Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 77 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB £2,061.30£1,717.75RRP £3,074.78Save £1,357.03
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Processor Processor base frequency 3 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7302P Processor threads 32 Processor operating modes 32-bit Processor boost frequency 3.3 GHz Component for Server/workstation Processor lithography 7 nm Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 AMD EPYC 7302P processor 3 GHz 128 MB L3 Tray£737.82Processor Processor base frequency 3 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7302P Processor threads 32 Processor operating modes 32-bit Processor boost frequency 3.3 GHz Component for Server/workstation Processor lithography 7 nm Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 £737.82£614.85RRP £873.08Save £258.24
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Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 2.9 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 150 W Processor cache 22 MB Processor ARK ID 199347 Processor model 6226R Processor threads 32 Processor operating modes 64-bit Processor boost frequency 3.9 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Box, Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 150 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available Yes Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 150 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q1'20 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 150 W Processor package size 76mm x 56.5mm Processor ARK ID 199347 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available Yes Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology Yes Intel Speed Select Technology (SST) No Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 85 °C Packaging data Package type Box, Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB Intel Xeon 6226R processor 2.9 GHz 22 MB Box, Tray£1,005.53Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 2.9 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 150 W Processor cache 22 MB Processor ARK ID 199347 Processor model 6226R Processor threads 32 Processor operating modes 64-bit Processor boost frequency 3.9 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Box, Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 150 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available Yes Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 150 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q1'20 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 150 W Processor package size 76mm x 56.5mm Processor ARK ID 199347 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available Yes Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology Yes Intel Speed Select Technology (SST) No Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 85 °C Packaging data Package type Box, Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB £1,005.53£837.94RRP £1,432.88Save £594.94
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Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 3.4 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 205 W Processor cache 35.75 MB Processor ARK ID 199353 Processor model 6246R Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.1 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q1'20 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 205 W Processor package size 76mm x 56.5mm Processor ARK ID 199353 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology Yes Intel Speed Select Technology (SST) No Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 75 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB Intel Xeon 6246R processor 3.4 GHz 35.75 MB Tray£2,485.20Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 3.4 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 205 W Processor cache 35.75 MB Processor ARK ID 199353 Processor model 6246R Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.1 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 16 Processor socket LGA 3647 (Socket P) Package type Tray Memory Maximum internal memory supported by processor 1.02 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q1'20 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 205 W Processor package size 76mm x 56.5mm Processor ARK ID 199353 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology Yes Intel Speed Select Technology (SST) No Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 75 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Other features Maximum internal memory 1 TB £2,485.20£2,071.00RRP £2,899.40Save £828.40
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Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5950X Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.9 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 AMD Ryzen 9 5950X processor 3.4 GHz 64 MB L3 Box£237.24Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5950X Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.9 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 £237.24£197.70RRP £284.69Save £86.99
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Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 3.1 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 205 W Processor cache 36 MB Processor ARK ID 212457 Processor model 6346 Processor threads 32 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.6 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Processor cores 16 Processor socket LGA 4189 Package type Tray High priority cores 4 High priority core frequency 3.2 GHz Low priority cores 12 Low priority core frequency 3 GHz Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212457 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Optane™ Memory Ready Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 78 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB Intel Xeon Gold 6346 processor 3.1 GHz 36 MB Tray£1,524.98Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 3.1 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 205 W Processor cache 36 MB Processor ARK ID 212457 Processor model 6346 Processor threads 32 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.6 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Processor cores 16 Processor socket LGA 4189 Package type Tray High priority cores 4 High priority core frequency 3.2 GHz Low priority cores 12 Low priority core frequency 3 GHz Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212457 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Optane™ Memory Ready Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 78 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB £1,524.98£1,270.82RRP £2,046.02Save £775.20
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Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.4 GHz Processor manufacturer Intel Cooler included No Thermal Design Power (TDP) 135 W Processor cache 24 MB Processor model 4314 Processor threads 32 System bus rate 10.4 GT/s Processor operating modes 64-bit Processor boost frequency 3.4 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel Xeon Silver Processor cores 16 Processor socket LGA 4189 Package type Tray Memory Maximum internal memory supported by processor 6.14 TB Memory clock speeds supported by processor 2667 MHz Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 135 W Technical details PCI Express slots version 4.0 Scalability 2S Thermal Design Power (TDP) 135 W Market segment Server Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 135 W PCI Express slots version 4.0 Scalability 2S Market segment Server Harmonized System (HS) code 85423119 Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 HPE Intel Xeon-Silver 4314 2.4GHz 16-core 135W Processor for£955.37Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.4 GHz Processor manufacturer Intel Cooler included No Thermal Design Power (TDP) 135 W Processor cache 24 MB Processor model 4314 Processor threads 32 System bus rate 10.4 GT/s Processor operating modes 64-bit Processor boost frequency 3.4 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel Xeon Silver Processor cores 16 Processor socket LGA 4189 Package type Tray Memory Maximum internal memory supported by processor 6.14 TB Memory clock speeds supported by processor 2667 MHz Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 135 W Technical details PCI Express slots version 4.0 Scalability 2S Thermal Design Power (TDP) 135 W Market segment Server Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 135 W PCI Express slots version 4.0 Scalability 2S Market segment Server Harmonized System (HS) code 85423119 Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 £955.37£796.14RRP £1,377.32Save £581.18
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Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.4 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 135 W Processor cache 24 MB Processor ARK ID 215269 Processor model 4314 Processor threads 32 System bus rate 10.4 GT/s Processor operating modes 64-bit Processor boost frequency 3.4 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel Xeon Silver Processor cores 16 Processor socket LGA 4189 Package type Box, Tray Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2667 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 135 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 135 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2667 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 135 W Processor package size 77.5 x 56.5 mm Processor ARK ID 215269 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available Yes Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 8 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 86 °C Packaging data Package type Box, Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB DELL Xeon Silver 4314 processor 2.4 GHz 24 MB Box, Tray£1,098.24Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.4 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 135 W Processor cache 24 MB Processor ARK ID 215269 Processor model 4314 Processor threads 32 System bus rate 10.4 GT/s Processor operating modes 64-bit Processor boost frequency 3.4 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel Xeon Silver Processor cores 16 Processor socket LGA 4189 Package type Box, Tray Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2667 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 135 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 135 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 2 Memory speed (max) 2667 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 135 W Processor package size 77.5 x 56.5 mm Processor ARK ID 215269 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available Yes Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 8 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 86 °C Packaging data Package type Box, Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB £1,098.24£915.20RRP £1,647.36Save £732.16
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Processor Processor generation AMD Ryzen Threadripper PRO 5000 WX-Series Processor base frequency 4 GHz Processor manufacturer AMD Cooler included Yes Thermal Design Power (TDP) 280 W Processor cache 64 MB Processor model 5955WX Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.5 GHz Processor lithography 7 nm Processor family AMD Ryzen Threadripper PRO Processor cores 16 Processor socket Socket sWRX8 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory channels Octa-channel Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 Compatible operating systems Windows 11/10 x64 Thermal Design Power (TDP) 280 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Compatible operating systems Windows 11/10 x64 Market segment Desktop Packaging data Package type Box AMD Ryzen Threadripper PRO 5955WX processor 4 GHz 64 MB L3 Box£1,188.80Processor Processor generation AMD Ryzen Threadripper PRO 5000 WX-Series Processor base frequency 4 GHz Processor manufacturer AMD Cooler included Yes Thermal Design Power (TDP) 280 W Processor cache 64 MB Processor model 5955WX Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.5 GHz Processor lithography 7 nm Processor family AMD Ryzen Threadripper PRO Processor cores 16 Processor socket Socket sWRX8 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory channels Octa-channel Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 Compatible operating systems Windows 11/10 x64 Thermal Design Power (TDP) 280 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Compatible operating systems Windows 11/10 x64 Market segment Desktop Packaging data Package type Box £1,188.80£990.67RRP £1,733.68Save £743.00
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Processor Processor generation AMD Ryzen Threadripper PRO 5000 WX-Series Processor base frequency 4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 280 W Processor cache 64 MB Processor model 5955WX Processor threads 32 Processor boost frequency 4.5 GHz Processor lithography 7 nm Processor family AMD Ryzen Threadripper PRO Processor cores 16 Processor socket Socket sWRX8 Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory channels Octa-channel Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 280 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Market segment Desktop Packaging data Package type Tray AMD Ryzen Threadripper PRO 5955WX processor 4 GHz 64 MB L3 Tray£911.12Processor Processor generation AMD Ryzen Threadripper PRO 5000 WX-Series Processor base frequency 4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 280 W Processor cache 64 MB Processor model 5955WX Processor threads 32 Processor boost frequency 4.5 GHz Processor lithography 7 nm Processor family AMD Ryzen Threadripper PRO Processor cores 16 Processor socket Socket sWRX8 Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory channels Octa-channel Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 280 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Market segment Desktop Packaging data Package type Tray £911.12£759.27RRP £1,267.99Save £508.71
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Processor Processor generation AMD Ryzen 7000 Series Processor base frequency 4.5 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 170 W Processor cache 64 MB Processor model 7950X Processor threads 32 Processor boost frequency 5.7 GHz Processor lithography 5 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM5 Processor cache type L3 Package type Tray Memory Memory channels Dual-channel Graphics Discrete graphics card No On-board graphics card model AMD Radeon Graphics On-board graphics card Yes Discrete graphics card model Not available Power Thermal Design Power (TDP) 170 W Technical details Compatible operating systems Windows 11/10 x64, RHEL, Ubuntu Thermal Design Power (TDP) 170 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 170 W Compatible operating systems Windows 11/10 x64, RHEL, Ubuntu Market segment Desktop Packaging data Package type Tray AMD Ryzen 9 7950X processor 4.5 GHz 64 MB L3 Tray£665.47Processor Processor generation AMD Ryzen 7000 Series Processor base frequency 4.5 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 170 W Processor cache 64 MB Processor model 7950X Processor threads 32 Processor boost frequency 5.7 GHz Processor lithography 5 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM5 Processor cache type L3 Package type Tray Memory Memory channels Dual-channel Graphics Discrete graphics card No On-board graphics card model AMD Radeon Graphics On-board graphics card Yes Discrete graphics card model Not available Power Thermal Design Power (TDP) 170 W Technical details Compatible operating systems Windows 11/10 x64, RHEL, Ubuntu Thermal Design Power (TDP) 170 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 170 W Compatible operating systems Windows 11/10 x64, RHEL, Ubuntu Market segment Desktop Packaging data Package type Tray £665.47£554.56RRP £953.84Save £399.28
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Processor Processor generation AMD Ryzen 9000 Series Processor base frequency 4.3 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 170 W Processor cache 144 MB Processor model 9950X3D Processor threads 32 Processor operating modes 64-bit Processor boost frequency 5.7 GHz Processor lithography 4 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM5 Processor cache type L2 & L3 Package type Box Memory Maximum internal memory supported by processor 192 GB Memory types supported by processor DDR5-SDRAM Memory clock speeds supported by processor 3600,5600 MHz Memory channels Dual-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model AMD Radeon Graphics On-board graphics card Yes On-board graphics card base frequency 2200 MHz Discrete graphics card model Not available Power Thermal Design Power (TDP) 170 W Technical details PCI Express slots version 5.0 Supported instruction sets AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 Thermal Design Power (TDP) 170 W Market segment Desktop Processor cache type L2 & L3 Features Maximum number of PCI Express lanes 28 Thermal Design Power (TDP) 170 W PCI Express slots version 5.0 Supported instruction sets AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 Market segment Desktop I/O configuration USB version 3.2 Gen 2 (3.1 Gen 2) USB ports quantity 4 Operational conditions Minimum operating temperature 95 °C Packaging data Package type Box AMD Ryzen 9 9950X3D processor 4.3 GHz 144 MB L2 & L3 Box£671.59Processor Processor generation AMD Ryzen 9000 Series Processor base frequency 4.3 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 170 W Processor cache 144 MB Processor model 9950X3D Processor threads 32 Processor operating modes 64-bit Processor boost frequency 5.7 GHz Processor lithography 4 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM5 Processor cache type L2 & L3 Package type Box Memory Maximum internal memory supported by processor 192 GB Memory types supported by processor DDR5-SDRAM Memory clock speeds supported by processor 3600,5600 MHz Memory channels Dual-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model AMD Radeon Graphics On-board graphics card Yes On-board graphics card base frequency 2200 MHz Discrete graphics card model Not available Power Thermal Design Power (TDP) 170 W Technical details PCI Express slots version 5.0 Supported instruction sets AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 Thermal Design Power (TDP) 170 W Market segment Desktop Processor cache type L2 & L3 Features Maximum number of PCI Express lanes 28 Thermal Design Power (TDP) 170 W PCI Express slots version 5.0 Supported instruction sets AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 Market segment Desktop I/O configuration USB version 3.2 Gen 2 (3.1 Gen 2) USB ports quantity 4 Operational conditions Minimum operating temperature 95 °C Packaging data Package type Box £671.59£559.66RRP £856.27Save £296.62
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