Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7302P
Processor threads	32
Processor operating modes	32-bit
Processor boost frequency	3.3 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7302P
Processor threads	32
Processor operating modes	32-bit
Processor boost frequency	3.3 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server

Processors