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Processor | |
---|---|
Processor base frequency | 2.4 GHz |
Thermal Design Power (TDP) | 130 W |
Processor cache | 30 MB |
Processor model | E7-4870 |
Processor threads | 20 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.8 GHz |
CPU multiplier (bus/core ratio) | 18 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 10 |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 130 W |
Features | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 69 °C |
Technical details | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Processor | |
---|---|
Processor base frequency | 2.4 GHz |
Thermal Design Power (TDP) | 130 W |
Processor cache | 30 MB |
Processor model | E7-4870 |
Processor threads | 20 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.8 GHz |
CPU multiplier (bus/core ratio) | 18 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 10 |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 130 W |
Features | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 69 °C |
Technical details | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
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