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Processors
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Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.8 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 32 MB Processor model 5800X Processor threads 16 Processor operating modes 64-bit Processor boost frequency 4.7 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 7 Processor cores 8 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 AMD Ryzen 7 5800X processor 3.8 GHz 32 MB L3 Box£139.44Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.8 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 32 MB Processor model 5800X Processor threads 16 Processor operating modes 64-bit Processor boost frequency 4.7 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 7 Processor cores 8 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 £139.44£116.20RRP £171.97Save £55.77
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Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.7 GHz Processor manufacturer AMD Cooler included Yes Thermal Design Power (TDP) 65 W Processor cache 32 MB Processor model 5600X Processor threads 12 Processor operating modes 64-bit Processor boost frequency 4.6 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 5 Processor cores 6 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 65 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 65 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 65 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 AMD Ryzen 5 5600X processor 3.7 GHz 32 MB L3 Box£128.29Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.7 GHz Processor manufacturer AMD Cooler included Yes Thermal Design Power (TDP) 65 W Processor cache 32 MB Processor model 5600X Processor threads 12 Processor operating modes 64-bit Processor boost frequency 4.6 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 5 Processor cores 6 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 65 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 65 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 65 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 £128.29£106.91RRP £156.09Save £49.18
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Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5950X Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.9 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 AMD Ryzen 9 5950X processor 3.4 GHz 64 MB L3 Box£234.49Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.4 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5950X Processor threads 32 Processor operating modes 64-bit Processor boost frequency 4.9 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 16 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 £234.49£195.41RRP £338.07Save £142.65
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Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.7 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5900X Processor threads 24 Processor operating modes 64-bit Processor boost frequency 4.8 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 12 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 AMD Ryzen 9 5900X processor 3.7 GHz 64 MB L3 Box£384.42Processor Processor generation AMD Ryzen 5000 Series Processor base frequency 3.7 GHz Processor manufacturer AMD Cooler included No Thermal Design Power (TDP) 105 W Processor cache 64 MB Processor model 5900X Processor threads 24 Processor operating modes 64-bit Processor boost frequency 4.8 GHz Component for PC Processor lithography 7 nm Processor family AMD Ryzen™ 9 Processor cores 12 Processor socket Socket AM4 Processor cache type L3 Package type Box Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Non-ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 105 W Technical details Intel® Hyper Threading Technology (Intel® HT Technology) No PCI Express slots version 4.0 Thermal Design Power (TDP) 105 W Market segment Desktop Processor cache type L3 Features Thermal Design Power (TDP) 105 W PCI Express slots version 4.0 Market segment Desktop Harmonized System (HS) code 85423119 Processor special features Intel® Hyper Threading Technology (Intel® HT Technology) No Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 £384.42£320.35RRP £525.37Save £205.02
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Processor Processor generation 10th gen Intel® Core™ i3 Processor base frequency 3.7 GHz Processor manufacturer Intel Cooler included Yes Processor codename Comet Lake Memory bandwidth supported by processor (max) 41.6 GB/s Thermal Design Power (TDP) 65 W Processor cache 6 MB Processor ARK ID 201894 Processor model i3-10105 Processor threads 8 System bus rate 8 GT/s Processor operating modes 64-bit Processor boost frequency 4.4 GHz Component for PC Processor lithography 14 nm Processor family Intel® Core™ i3 Processor cores 4 Processor socket LGA 1200 (Socket H5) Processor cache type Smart Cache Package type Box Memory Maximum internal memory supported by processor 128 GB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2666 MHz Memory bandwidth supported by processor (max) 41.6 GB/s Supported memory types DDR4-SDRAM Memory channels Dual-channel Memory bandwidth (max) 41.6 GB/s ECC No Graphics Discrete graphics card No On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels On-board graphics card ID 0x9BC8 On-board graphics card 4K support Yes On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 4096 x 2304 pixels On-board graphics card refresh rate at maximum resolution (HDMI) 30 Hz On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz Maximum on-board graphics card memory 64 GB Number of displays supported (on-board graphics) 3 On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels On-board graphics card DirectX version 12.0 On-board graphics card OpenGL version 4.5 On-board graphics card model Intel® UHD Graphics 630 On-board graphics card Yes On-board graphics card dynamic frequency (max) 1100 MHz On-board graphics card base frequency 350 MHz Discrete graphics card model Not available Power Thermal Design Power (TDP) 65 W Technical details Intel Stable Image Platform Program (SIPP) No Thermal solution specification PCG 2015C Intel® Secure Key Yes Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology No Intel® Quick Sync Video Technology Yes Intel® InTru™ 3D Technology Yes Intel® Identity Protection Technology (Intel® IPT) Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No CPU configuration (max) 1 Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 65 W Supported memory types DDR4-SDRAM Status Launched Market segment Desktop Launch date Q1'21 Intel Virtualization Technology (VT-x) Yes Processor cache type Smart Cache Features On-board graphics card ID 0x9BC8 Maximum number of PCI Express lanes 16 Thermal Design Power (TDP) 65 W Processor package size 37.5 x 37.5 mm Processor ARK ID 201894 Thermal solution specification PCG 2015C Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Embedded options available No CPU configuration (max) 1 Market segment Desktop Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 Use conditions PC/Client/Tablet Processor special features Intel Clear Video Technology Yes Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Optane™ Memory Ready Yes Intel® OS Guard Yes Intel Stable Image Platform Program (SIPP) No Intel® Secure Key Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology No Intel® Quick Sync Video Technology Yes Intel® InTru™ 3D Technology Yes Intel® Identity Protection Technology (Intel® IPT) Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes Intel® Boot Guard Yes Intel® Thermal Velocity Boost No Intel® vPro™ Platform Eligibility No Intel® Turbo Boost Technology 2.0 frequency 4.4 GHz Intel® Transactional Synchronization Extensions No Operational conditions Tjunction 100 °C Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 37.5 x 37.5 mm Other features Maximum internal memory 128 GB CPU configuration (max) 1 Intel Core i3-10105 processor 3.7 GHz 6 MB Smart Cache Box£200.99Processor Processor generation 10th gen Intel® Core™ i3 Processor base frequency 3.7 GHz Processor manufacturer Intel Cooler included Yes Processor codename Comet Lake Memory bandwidth supported by processor (max) 41.6 GB/s Thermal Design Power (TDP) 65 W Processor cache 6 MB Processor ARK ID 201894 Processor model i3-10105 Processor threads 8 System bus rate 8 GT/s Processor operating modes 64-bit Processor boost frequency 4.4 GHz Component for PC Processor lithography 14 nm Processor family Intel® Core™ i3 Processor cores 4 Processor socket LGA 1200 (Socket H5) Processor cache type Smart Cache Package type Box Memory Maximum internal memory supported by processor 128 GB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2666 MHz Memory bandwidth supported by processor (max) 41.6 GB/s Supported memory types DDR4-SDRAM Memory channels Dual-channel Memory bandwidth (max) 41.6 GB/s ECC No Graphics Discrete graphics card No On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels On-board graphics card ID 0x9BC8 On-board graphics card 4K support Yes On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 4096 x 2304 pixels On-board graphics card refresh rate at maximum resolution (HDMI) 30 Hz On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz Maximum on-board graphics card memory 64 GB Number of displays supported (on-board graphics) 3 On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels On-board graphics card DirectX version 12.0 On-board graphics card OpenGL version 4.5 On-board graphics card model Intel® UHD Graphics 630 On-board graphics card Yes On-board graphics card dynamic frequency (max) 1100 MHz On-board graphics card base frequency 350 MHz Discrete graphics card model Not available Power Thermal Design Power (TDP) 65 W Technical details Intel Stable Image Platform Program (SIPP) No Thermal solution specification PCG 2015C Intel® Secure Key Yes Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology No Intel® Quick Sync Video Technology Yes Intel® InTru™ 3D Technology Yes Intel® Identity Protection Technology (Intel® IPT) Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No CPU configuration (max) 1 Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 65 W Supported memory types DDR4-SDRAM Status Launched Market segment Desktop Launch date Q1'21 Intel Virtualization Technology (VT-x) Yes Processor cache type Smart Cache Features On-board graphics card ID 0x9BC8 Maximum number of PCI Express lanes 16 Thermal Design Power (TDP) 65 W Processor package size 37.5 x 37.5 mm Processor ARK ID 201894 Thermal solution specification PCG 2015C Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Embedded options available No CPU configuration (max) 1 Market segment Desktop Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 Use conditions PC/Client/Tablet Processor special features Intel Clear Video Technology Yes Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Optane™ Memory Ready Yes Intel® OS Guard Yes Intel Stable Image Platform Program (SIPP) No Intel® Secure Key Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology No Intel® Quick Sync Video Technology Yes Intel® InTru™ 3D Technology Yes Intel® Identity Protection Technology (Intel® IPT) Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes Intel® Boot Guard Yes Intel® Thermal Velocity Boost No Intel® vPro™ Platform Eligibility No Intel® Turbo Boost Technology 2.0 frequency 4.4 GHz Intel® Transactional Synchronization Extensions No Operational conditions Tjunction 100 °C Packaging data Package type Box Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 37.5 x 37.5 mm Other features Maximum internal memory 128 GB CPU configuration (max) 1 £200.99£167.49RRP £269.65Save £102.17
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Processor Processor base frequency 3 GHz Processor manufacturer AMD Cooler included No Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7313 Processor threads 32 Processor boost frequency 3.7 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Configurable TDP-up 180 W Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Configurable TDP-up 180 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 180 W Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 AMD EPYC 7313 processor 3 GHz 128 MB L3 Tray£863.22Processor Processor base frequency 3 GHz Processor manufacturer AMD Cooler included No Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7313 Processor threads 32 Processor boost frequency 3.7 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Configurable TDP-up 180 W Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Configurable TDP-up 180 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 180 W Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 £863.22£719.35RRP £1,028.67Save £309.32
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Processor Processor base frequency 2.45 GHz Processor manufacturer AMD Thermal Design Power (TDP) 280 W Processor cache 256 MB Processor model 7763 Processor threads 128 Processor boost frequency 3.5 GHz L3 cache speed 280 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 64 Processor socket Socket SP3 Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 L3 cache speed 280 GHz Thermal Design Power (TDP) 280 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Logistics data Harmonized System (HS) code 85423119 AMD EPYC 7763 processor 2.45 GHz 256 MB L3£4,276.26Processor Processor base frequency 2.45 GHz Processor manufacturer AMD Thermal Design Power (TDP) 280 W Processor cache 256 MB Processor model 7763 Processor threads 128 Processor boost frequency 3.5 GHz L3 cache speed 280 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 64 Processor socket Socket SP3 Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Thermal Design Power (TDP) 280 W Technical details PCI Express slots version 4.0 L3 cache speed 280 GHz Thermal Design Power (TDP) 280 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 280 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Logistics data Harmonized System (HS) code 85423119 £4,276.26£3,563.55RRP £5,951.13Save £2,387.58
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Processor Processor base frequency 2.65 GHz Processor manufacturer AMD Cooler included No Configurable TDP-down 165 W Thermal Design Power (TDP) 180 W Processor cache 128 MB Processor model 7413 Processor threads 48 Processor boost frequency 3.6 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 24 Processor socket Socket SP3 Configurable TDP-up 200 W Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Configurable TDP-down 165 W Thermal Design Power (TDP) 180 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 180 W Market segment Server Configurable TDP-up 200 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 180 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 200 W Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 AMD EPYC 7413 processor 2.65 GHz 128 MB L3 Tray£560.88Processor Processor base frequency 2.65 GHz Processor manufacturer AMD Cooler included No Configurable TDP-down 165 W Thermal Design Power (TDP) 180 W Processor cache 128 MB Processor model 7413 Processor threads 48 Processor boost frequency 3.6 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 24 Processor socket Socket SP3 Configurable TDP-up 200 W Processor cache type L3 Package type Tray Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Configurable TDP-down 165 W Thermal Design Power (TDP) 180 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 180 W Market segment Server Configurable TDP-up 200 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 180 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 200 W Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 £560.88£467.40RRP £752.51Save £285.11
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Processor Processor base frequency 3 GHz Processor manufacturer AMD Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7313P Processor threads 32 Processor boost frequency 3.7 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Configurable TDP-up 180 W Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Configurable TDP-up 180 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 180 W Logistics data Harmonized System (HS) code 85423119 AMD EPYC 7313P processor 3 GHz 128 MB L3£740.45Processor Processor base frequency 3 GHz Processor manufacturer AMD Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Processor cache 128 MB Processor model 7313P Processor threads 32 Processor boost frequency 3.7 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 16 Processor socket Socket SP3 Configurable TDP-up 180 W Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Configurable TDP-down 155 W Thermal Design Power (TDP) 155 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 155 W Market segment Server Configurable TDP-up 180 W Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 155 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Processor special features Configurable TDP-up 180 W Logistics data Harmonized System (HS) code 85423119 £740.45£617.04RRP £925.56Save £308.52
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Processor Processor base frequency 3.2 GHz Processor manufacturer AMD Thermal Design Power (TDP) 240 W Processor cache 256 MB Processor model 74F3 Processor threads 48 Processor boost frequency 4 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 24 Processor socket Socket SP3 Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Thermal Design Power (TDP) 240 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 240 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 240 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Logistics data Harmonized System (HS) code 85423119 AMD EPYC 74F3 processor 3.2 GHz 256 MB L3£2,155.90Processor Processor base frequency 3.2 GHz Processor manufacturer AMD Thermal Design Power (TDP) 240 W Processor cache 256 MB Processor model 74F3 Processor threads 48 Processor boost frequency 4 GHz Component for Server/workstation Processor family AMD EPYC Processor cores 24 Processor socket Socket SP3 Processor cache type L3 Memory Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Memory channels Octa-channel Memory bandwidth (max) 204.8 GB/s Power Thermal Design Power (TDP) 240 W Technical details PCI Express slots version 4.0 Thermal Design Power (TDP) 240 W Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 128 Thermal Design Power (TDP) 240 W PCI Express slots version 4.0 Market segment Server Harmonized System (HS) code 85423119 Logistics data Harmonized System (HS) code 85423119 £2,155.90£1,796.58RRP £3,000.29Save £1,203.71
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Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.6 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 235 W Processor cache 42 MB Processor ARK ID 212456 Processor model 6348 Processor threads 56 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.5 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Processor cores 28 Processor socket LGA 4189 Package type Tray High priority cores 12 High priority core frequency 2.8 GHz Low priority cores 16 Low priority core frequency 2.5 GHz Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 235 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 235 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 235 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212456 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Optane™ Memory Ready Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 80 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB Intel Xeon Gold 6348 processor 2.6 GHz 42 MB Tray£2,051.34Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 2.6 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 235 W Processor cache 42 MB Processor ARK ID 212456 Processor model 6348 Processor threads 56 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.5 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Processor cores 28 Processor socket LGA 4189 Package type Tray High priority cores 12 High priority core frequency 2.8 GHz Low priority cores 16 Low priority core frequency 2.5 GHz Memory Maximum internal memory supported by processor 6.14 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 3200 MHz Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 235 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 235 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 235 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212456 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Optane™ Memory Ready Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 80 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB £2,051.34£1,709.45RRP £2,803.51Save £1,094.05
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Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 3 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 205 W Processor cache 39 MB Processor ARK ID 212460 Processor model 6354 Processor threads 36 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.6 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Gold Processor cores 18 Box No Processor socket LGA 4189 High priority cores 8 High priority core frequency 3.1 GHz Low priority cores 10 Low priority core frequency 2.8 GHz Memory Maximum internal memory supported by processor 6 TB Memory types supported by processor DDR4-SDRAM Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212460 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 77 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB Intel Xeon Gold 6354 processor 3 GHz 39 MB£1,967.50Processor Processor generation 3rd Generation Intel® Xeon® Scalable Processor base frequency 3 GHz Processor manufacturer Intel Cooler included No Processor codename Ice Lake Thermal Design Power (TDP) 205 W Processor cache 39 MB Processor ARK ID 212460 Processor model 6354 Processor threads 36 System bus rate 11.2 GT/s Processor operating modes 64-bit Processor boost frequency 3.6 GHz Component for Server/workstation Processor lithography 10 nm Processor family Intel® Xeon® Gold Processor cores 18 Box No Processor socket LGA 4189 High priority cores 8 High priority core frequency 3.1 GHz Low priority cores 10 Low priority core frequency 2.8 GHz Memory Maximum internal memory supported by processor 6 TB Memory types supported by processor DDR4-SDRAM Supported memory types DDR4-SDRAM Memory channels Octa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 205 W Technical details Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 205 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'21 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 3200 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Target market Cloud Computing Servicing status Baseline Servicing Features Maximum number of PCI Express lanes 64 Thermal Design Power (TDP) 205 W Processor package size 77.5 x 56.5 mm Processor ARK ID 212460 Execute Disable Bit Yes PCI Express slots version 4.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 2S Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992CN3 Commodity Classification Automated Tracking System (CCATS) G178966 Processor special features Intel Software Guard Extensions (Intel SGX) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel® Speed Shift Technology Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® Transactional Synchronization Extensions Yes Intel® Total Memory Encryption Yes Maximum Enclave Size Support for Intel® SGX 64 GB Intel® Platform Firmware Resilience Support Yes Intel® Crypto Acceleration Yes Operational conditions Tcase 77 °C Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 77.5 x 56.5 mm Other features Maximum internal memory 6 TB £1,967.50£1,639.58RRP £2,934.85Save £1,295.27
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