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Processor | |
---|---|
Processor base frequency | 2.26 GHz |
Thermal Design Power (TDP) | 80 W |
Processor cache | 8 MB |
Processor system type | DP |
Processor model | E5520 |
Processor operating modes | 64-bit |
VID Voltage Range | 0.75 - 1.35 V |
Stepping | D0 |
L3 cache speed | 2.26 GHz |
CPU multiplier (bus/core ratio) | 17 |
Component for | Server/workstation |
Processor lithography | 45 nm |
Processor family | Intel® Xeon® 5000 Sequence |
Processor cores | 4 |
Box | No |
Processor socket | Socket B (LGA 1366) |
Processor code | SLBFD |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 80 W |
VID Voltage Range | 0.75 - 1.35 V |
Technical details | |
L3 cache speed | 2.26 GHz |
Processor code | SLBFD |
Thermal Design Power (TDP) | 80 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 80 W |
Processor code | SLBFD |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 76 °C |
Other features | |
Processor code | SLBFD |
Processor | |
---|---|
Processor base frequency | 2.26 GHz |
Thermal Design Power (TDP) | 80 W |
Processor cache | 8 MB |
Processor system type | DP |
Processor model | E5520 |
Processor operating modes | 64-bit |
VID Voltage Range | 0.75 - 1.35 V |
Stepping | D0 |
L3 cache speed | 2.26 GHz |
CPU multiplier (bus/core ratio) | 17 |
Component for | Server/workstation |
Processor lithography | 45 nm |
Processor family | Intel® Xeon® 5000 Sequence |
Processor cores | 4 |
Box | No |
Processor socket | Socket B (LGA 1366) |
Processor code | SLBFD |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 80 W |
VID Voltage Range | 0.75 - 1.35 V |
Technical details | |
L3 cache speed | 2.26 GHz |
Processor code | SLBFD |
Thermal Design Power (TDP) | 80 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 80 W |
Processor code | SLBFD |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 76 °C |
Other features | |
Processor code | SLBFD |
Save £17.48
Processor | |
---|---|
Processor base frequency | 2.13 GHz |
Thermal Design Power (TDP) | 105 W |
Processor cache | 24 MB |
Processor model | E7-2830 |
Processor threads | 16 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.4 GHz |
Stepping | A2 |
CPU multiplier (bus/core ratio) | 16 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 8 |
Box | No |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 105 W |
Features | |
Thermal Design Power (TDP) | 105 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 64 °C |
Technical details | |
Thermal Design Power (TDP) | 105 W |
Market segment | Server |
Processor cache type | L3 |
Processor | |
---|---|
Processor base frequency | 2.13 GHz |
Thermal Design Power (TDP) | 105 W |
Processor cache | 24 MB |
Processor model | E7-2830 |
Processor threads | 16 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.4 GHz |
Stepping | A2 |
CPU multiplier (bus/core ratio) | 16 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 8 |
Box | No |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 105 W |
Features | |
Thermal Design Power (TDP) | 105 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 64 °C |
Technical details | |
Thermal Design Power (TDP) | 105 W |
Market segment | Server |
Processor cache type | L3 |
Save £12.83
Processor | |
---|---|
Processor base frequency | 2.6 GHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Thermal Design Power (TDP) | 80 W |
Processor cache | 15 MB |
Processor model | E5-2630V2 |
Processor threads | 12 |
System bus rate | 7.2 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.6 - 1.30 V |
Processor boost frequency | 3.1 GHz |
Number of QPI links | 2 |
Bus type | QPI |
Component for | Server/workstation |
Processor lithography | 22 nm |
Processor family | Intel® Xeon® E5 V2 Family |
Processor front side bus | 1600 MHz |
Processor cores | 6 |
Processor socket | LGA 2011 (Socket R) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333,1600 MHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 80 W |
VID Voltage Range | 0.6 - 1.30 V |
Technical details | |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Thermal Design Power (TDP) | 80 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 40 |
Thermal Design Power (TDP) | 80 W |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Embedded options available | Yes |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 71 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Processor | |
---|---|
Processor base frequency | 2.6 GHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Thermal Design Power (TDP) | 80 W |
Processor cache | 15 MB |
Processor model | E5-2630V2 |
Processor threads | 12 |
System bus rate | 7.2 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.6 - 1.30 V |
Processor boost frequency | 3.1 GHz |
Number of QPI links | 2 |
Bus type | QPI |
Component for | Server/workstation |
Processor lithography | 22 nm |
Processor family | Intel® Xeon® E5 V2 Family |
Processor front side bus | 1600 MHz |
Processor cores | 6 |
Processor socket | LGA 2011 (Socket R) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333,1600 MHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 80 W |
VID Voltage Range | 0.6 - 1.30 V |
Technical details | |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Thermal Design Power (TDP) | 80 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 40 |
Thermal Design Power (TDP) | 80 W |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Embedded options available | Yes |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 71 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Save £15.34
Processor | |
---|---|
Processor base frequency | 2.4 GHz |
Thermal Design Power (TDP) | 130 W |
Processor cache | 30 MB |
Processor model | E7-4870 |
Processor threads | 20 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.8 GHz |
CPU multiplier (bus/core ratio) | 18 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 10 |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 130 W |
Features | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 69 °C |
Technical details | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Processor | |
---|---|
Processor base frequency | 2.4 GHz |
Thermal Design Power (TDP) | 130 W |
Processor cache | 30 MB |
Processor model | E7-4870 |
Processor threads | 20 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 2.8 GHz |
CPU multiplier (bus/core ratio) | 18 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E7 Family |
Processor cores | 10 |
Processor socket | LGA 1567 (Socket LS) |
Processor cache type | L3 |
Power | |
Thermal Design Power (TDP) | 130 W |
Features | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 69 °C |
Technical details | |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Save £18.47
Processor | |
---|---|
Processor base frequency | 2.5 GHz |
Memory bandwidth supported by processor (max) | 42.6 GB/s |
Thermal Design Power (TDP) | 95 W |
Processor cache | 15 MB |
Processor model | E5-2640 |
Processor threads | 12 |
System bus rate | 7.20 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.6 - 1.35 V |
Processor boost frequency | 3 GHz |
CPU multiplier (bus/core ratio) | 30 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E5 Family |
Processor cores | 6 |
Box | No |
Processor socket | LGA 2011 (Socket R) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 750 GB |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory bandwidth supported by processor (max) | 42.6 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Power | |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.6 - 1.35 V |
Features | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Operational conditions | |
Maximum operating temperature | 77.4 °C |
Technical details | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Processor cache type | L3 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.5 GHz |
Memory bandwidth supported by processor (max) | 42.6 GB/s |
Thermal Design Power (TDP) | 95 W |
Processor cache | 15 MB |
Processor model | E5-2640 |
Processor threads | 12 |
System bus rate | 7.20 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.6 - 1.35 V |
Processor boost frequency | 3 GHz |
CPU multiplier (bus/core ratio) | 30 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E5 Family |
Processor cores | 6 |
Box | No |
Processor socket | LGA 2011 (Socket R) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 750 GB |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory bandwidth supported by processor (max) | 42.6 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Power | |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.6 - 1.35 V |
Features | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Operational conditions | |
Maximum operating temperature | 77.4 °C |
Technical details | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Processor cache type | L3 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £16.38
Save £6.18