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Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
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