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Memory Modules
-
Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 4800MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro PnP Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,279.00
£1,065.83RRP £1,769.28Save £703.45
In stock
-
Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £1,896.87Save £781.06
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £1,852.72Save £641.79
In stock
-
Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL28 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £1,818.76Save £702.96
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £2,082.80Save £871.87
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,564.04
£1,303.37RRP £1,994.15Save £690.78
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,601.78
£1,334.82RRP £2,068.97Save £734.15
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6800MT/s DDR5 ECC Reg CL34 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,885.97
£1,571.64RRP £2,357.46Save £785.82
In stock
-
Design |
---|
Compatible products | HPE Compute Mainstream Platforms, see QuickSpecs for more information |
Memory |
---|
Internal memory | 256 GB |
Memory ranking | 4 |
Internal memory type | DDR5 |
Features |
---|
Compatible products | HPE Compute Mainstream Platforms, see QuickSpecs for more information |
Internal memory | 256 GB |
Memory ranking | 4 |
Internal memory type | DDR5 |
Memory data transfer rate | 6400 MT/s |
Weight & dimensions |
---|
Width | 88.9 mm |
Depth | 190.5 mm |
Height | 19.1 mm |
HPE 256GB (1x256GB) Quad Rank x4 DDR5-6400 CAS-60-52-52 EC8 Registered 3DS Smart Memory Kit Design |
---|
Compatible products | HPE Compute Mainstream Platforms, see QuickSpecs for more information |
Memory |
---|
Internal memory | 256 GB |
Memory ranking | 4 |
Internal memory type | DDR5 |
Features |
---|
Compatible products | HPE Compute Mainstream Platforms, see QuickSpecs for more information |
Internal memory | 256 GB |
Memory ranking | 4 |
Internal memory type | DDR5 |
Memory data transfer rate | 6400 MT/s |
Weight & dimensions |
---|
Width | 88.9 mm |
Depth | 190.5 mm |
Height | 19.1 mm |
£18,943.42
£15,786.18RRP £25,731.47Save £9,945.29
In stock
-
Power |
---|
Memory voltage | 1.25 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 4 x 64 GB |
Internal memory | 256 GB |
Component for | PC |
Memory voltage | 1.25 V |
Memory channels | Dual-channel/Quad-channel |
ECC | No |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 4 x 64 GB |
Internal memory | 256 GB |
Component for | PC |
Memory voltage | 1.25 V |
Memory channels | Dual-channel/Quad-channel |
ECC | No |
Internal memory type | DDR5 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Weight & dimensions |
---|
Height | 33 mm |
G.Skill Flare X5 F5-6000J3644D64GX4-FX5 memory module 256 GB 4 x 64 GB DDR5 5600 MT/s Power |
---|
Memory voltage | 1.25 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 4 x 64 GB |
Internal memory | 256 GB |
Component for | PC |
Memory voltage | 1.25 V |
Memory channels | Dual-channel/Quad-channel |
ECC | No |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 4 x 64 GB |
Internal memory | 256 GB |
Component for | PC |
Memory voltage | 1.25 V |
Memory channels | Dual-channel/Quad-channel |
ECC | No |
Internal memory type | DDR5 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Weight & dimensions |
---|
Height | 33 mm |
£1,075.21
£896.01RRP £1,559.05Save £663.05
In stock
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