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Memory Modules
-
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 4800MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro PnP | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,263.07
£1,052.56RRP £1,778.82Save £726.27
In stock
-
| Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro XMP | Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £1,863.40Save £747.59
In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £1,998.03Save £787.10
In stock
-
| Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL28 DIMM (Kit of 8) Renegade Pro EXPO | Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £2,008.45Save £892.65
In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £1,876.94Save £666.01
In stock
-
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO | Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,564.04
£1,303.37RRP £2,228.76Save £925.39
In stock
-
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP | Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,601.78
£1,334.82RRP £2,189.11Save £854.29
In stock
-
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Memory data transfer rate | 6800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6800MT/s DDR5 ECC Reg CL34 DIMM (Kit of 8) Renegade Pro XMP | Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Memory data transfer rate | 6800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 3.8 mm |
| Depth | 133.3 mm |
| Height | 31.2 mm |
| Weight | 173.6 g |
| Package weight | 190.51 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 190.51 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,885.97
£1,571.64RRP £2,231.73Save £660.09
In stock
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