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Memory Modules
Power Memory voltage 1.2 V Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 2048M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 2048M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 2Rx8
Samsung M378A4G43AB2-CWE memory module 32 GB 1 x 32 GB DDR4 3200 MHz Power Memory voltage 1.2 V Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 2048M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 2048M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 2Rx8
£118.68
£98.90 Out of stock
Design Compatible products HP ProDesk 400 G5/6 Desktop Mini, HP ProDesk 600 G5/6 Desktop Mini, HP EliteDesk 705 G5 Desktop Mini, HP EliteDesk 805 G6 Desktop Mini, HP EliteDesk 800 G5/6 95W Desktop Mini, HP Collaboration PC G5, HP EliteOne 800 G5/6 AiO G5 23.8 HC (NT), HP Elite Slice for Meeting Rooms G2. Memory Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory clock speed 3200 MHz Internal memory type DDR4 Features Compatible products HP ProDesk 400 G5/6 Desktop Mini, HP ProDesk 600 G5/6 Desktop Mini, HP EliteDesk 705 G5 Desktop Mini, HP EliteDesk 805 G6 Desktop Mini, HP EliteDesk 800 G5/6 95W Desktop Mini, HP Collaboration PC G5, HP EliteOne 800 G5/6 AiO G5 23.8 HC (NT), HP Elite Slice for Meeting Rooms G2. Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory clock speed 3200 MHz Internal memory type DDR4 Harmonized System (HS) code 84733020 Weight & dimensions Width 133 mm Depth 1 mm Height 31 mm Weight 18.18 g Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020
HP 32GB DDR4-3200 DIMM Design Compatible products HP ProDesk 400 G5/6 Desktop Mini, HP ProDesk 600 G5/6 Desktop Mini, HP EliteDesk 705 G5 Desktop Mini, HP EliteDesk 805 G6 Desktop Mini, HP EliteDesk 800 G5/6 95W Desktop Mini, HP Collaboration PC G5, HP EliteOne 800 G5/6 AiO G5 23.8 HC (NT), HP Elite Slice for Meeting Rooms G2. Memory Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory clock speed 3200 MHz Internal memory type DDR4 Features Compatible products HP ProDesk 400 G5/6 Desktop Mini, HP ProDesk 600 G5/6 Desktop Mini, HP EliteDesk 705 G5 Desktop Mini, HP EliteDesk 805 G6 Desktop Mini, HP EliteDesk 800 G5/6 95W Desktop Mini, HP Collaboration PC G5, HP EliteOne 800 G5/6 AiO G5 23.8 HC (NT), HP Elite Slice for Meeting Rooms G2. Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory clock speed 3200 MHz Internal memory type DDR4 Harmonized System (HS) code 84733020 Weight & dimensions Width 133 mm Depth 1 mm Height 31 mm Weight 18.18 g Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020
£298.55
£248.79 Out of stock
Power Memory voltage 1.2 V Technical details Chips organisation 1Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 1Rx8
Samsung M378A1K43EB2-CWE memory module 8 GB 1 x 8 GB DDR4 3200 MHz Power Memory voltage 1.2 V Technical details Chips organisation 1Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 1Rx8
£56.76
£47.30 Out of stock
Power Memory voltage 1.2 V Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 2Rx8
Samsung M378A2K43EB1-CWE memory module 16 GB 1 x 16 GB DDR4 3200 MHz Power Memory voltage 1.2 V Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM Memory voltage 1.2 V Module configuration 1024M x 8 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Other features Chips organisation 2Rx8
£95.46
£79.55 Out of stock
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM ECC No Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM ECC No Memory clock speed 2666 MHz Internal memory type DDR4
Origin Storage 16GB DDR4 2666MHz UDIMM 2Rx8 CL19 Non-ECC 1.2V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM ECC No Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM ECC No Memory clock speed 2666 MHz Internal memory type DDR4
£39.58
£32.98 Out of stock
Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 260 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 260 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3600 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 187.28 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL17 DIMM (Kit of 4) RGB Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 260 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 260 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3600 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 187.28 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
£103.44
£86.20 Out of stock
Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 187.28 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) RGB Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 8 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 187.28 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
£98.15
£81.79 Out of stock
Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 32 GB Internal memory 128 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 32 GB Internal memory 128 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 196.08 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY Beast 128GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) RGB Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 4 x 32 GB Internal memory 128 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 4 x 32 GB Internal memory 128 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 196.08 g Package weight 259.33 g Packaging data Package width 121.9 mm Package depth 25.4 mm Package height 171.4 mm Package weight 259.33 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.01 kg Products per master (outer) case 7 pc(s) Other features Country of origin China, Taiwan
£246.25
£205.21 Out of stock
Memory Package type Box Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Power Memory voltage 1.35 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.29 mm Depth 133.3 mm Height 42 mm Weight 41.5 g Package type Box Package weight 97.29 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package type Box Package weight 97.29 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 1.65 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY 8GB 3200MT/s DDR4 CL16 DIMM Renegade Black Memory Package type Box Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Power Memory voltage 1.35 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.29 mm Depth 133.3 mm Height 42 mm Weight 41.5 g Package type Box Package weight 97.29 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package type Box Package weight 97.29 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 1.65 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
£30.05
£25.04 Out of stock
Memory Package type Box Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory channels Dual-channel Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Power Memory voltage 1.35 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory channels Dual-channel Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.29 mm Depth 133.3 mm Height 42 mm Weight 83.4 g Package type Box Package weight 143.23 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package type Box Package weight 143.23 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.34 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black Memory Package type Box Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory channels Dual-channel Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Power Memory voltage 1.35 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Features Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory channels Dual-channel Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.29 mm Depth 133.3 mm Height 42 mm Weight 83.4 g Package type Box Package weight 143.23 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package type Box Package weight 143.23 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.34 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
£47.92
£39.93 Out of stock
Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for PC Memory form factor 288-pin DIMM CAS latency 18 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features On-Die ECC No Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for PC Memory form factor 288-pin DIMM CAS latency 18 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3600 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 108.38 g Package weight 157.23 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package weight 157.23 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.55 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY 64GB 3600MT/s DDR4 CL18 DIMM (Kit of 2) Renegade RGB Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for PC Memory form factor 288-pin DIMM CAS latency 18 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features On-Die ECC No Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for PC Memory form factor 288-pin DIMM CAS latency 18 Memory voltage 1.35 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3600 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 108.38 g Package weight 157.23 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package weight 157.23 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 2.55 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
£146.29
£121.91 Out of stock
Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 54.19 g Package weight 104.29 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package weight 104.29 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 1.76 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM 1Gx8 Renegade RGB Power Memory voltage 1.35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 2.0 Backlight colour Red/Green/Blue Backlight Yes Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1.35 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 45.75 ns Refresh row cycle time 350 ns Row active time 32 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR4 Programming power voltage (VPP) 2.5 V JEDEC standard Yes Memory data transfer rate 3200 MT/s Operational conditions Operating temperature (T-T) 0 - 70 °C Storage temperature (T-T) -40 - 85 °C Weight & dimensions Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Width 8.2 mm Depth 133.3 mm Height 43 mm Weight 54.19 g Package weight 104.29 g Packaging data Package width 129.5 mm Package depth 16 mm Package height 171.4 mm Package weight 104.29 g Logistics data Master (outer) case width 181.6 mm Master (outer) case length 254 mm Master (outer) case height 147.3 mm Master (outer) case gross weight 1.76 kg Products per master (outer) case 15 pc(s) Other features Country of origin China, Taiwan
£47.92
£39.93 Out of stock
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