Name: Origin Storage 2x32GB DDR4 3200MHz SODIMM 2Rx8 Non-ECC 1.2V
Brand: Origin Storage
SKU: CT2K32G4SFD832A-OS
Price: 126.95 GBP
Availability: InStock

Crucial CT2K32G4SFD832A memory module 64 GB 2 x 32 GB DDR4 3200 MHz

£223.52

RRP £312.93

Save £126.66

In stock

More Info

Add to Wish List Add to Compare

Kingston Technology FURY 64GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

£219.76

RRP £309.49

Save £126.36

In stock

More Info

Add to Wish List Add to Compare

Corsair Vengeance memory module 64 GB 2 x 32 GB DDR4

£262.04

RRP £386.52

Save £168.15

In stock

More Info

Add to Wish List Add to Compare

Corsair Vengeance memory module 64 GB 2 x 32 GB DDR4 3200 MHz

£167.18

RRP £217.34

Save £78.02

In stock

More Info

Add to Wish List Add to Compare

Origin Storage 2x32GB DDR4 3200MHz SODIMM 2Rx8 Non-ECC 1.2V

£126.95

RRP £165.03

Save £59.24

In stock

More Info

Add to Wish List Add to Compare

Power
Memory voltage	1.2 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	22
Memory voltage	1.2 V
Lead plating	Gold
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	22
Memory voltage	1.2 V
Lead plating	Gold
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	22
Memory voltage	1.2 V
Lead plating	Gold
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	22
Memory voltage	1.2 V
Lead plating	Gold
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	19 g
Package weight	45.6 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	45.6 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.35 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	19 g
Package weight	45.6 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	45.6 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.35 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Technical details
Country of origin	China
Memory
SPD speed	2666 MHz
SPD voltage	1.2 V
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	18
Memory voltage	1.2 V
SPD profile	Yes
Memory clock speed	2666 MHz
Internal memory type	DDR4
Features
SPD speed	2666 MHz
SPD voltage	1.2 V
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	18
Memory voltage	1.2 V
SPD profile	Yes
Country of origin	China
Memory clock speed	2666 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	China
Harmonized System (HS) code	84733020

FREE SHIPPING ON ALL ORDERS

MONEY BACK GUARANTEE

24/7 ONLINE SUPPORT

SECURE PAYMENT

Memory Modules

Best Selling Product

Tracking Information