Name: Kingston Technology KTL-TN548T-16G memory module 16 GB 1 x 16 GB DDR5 ECC
Brand: Kingston Technology
SKU: KTL-TN548T-16G
Price: 103.43 GBP
Availability: InStock

Crucial CT16G48C40S5 memory module 16 GB 1 x 16 GB DDR5 4800 MHz

£49.44

RRP £64.28

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Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact

£55.13

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Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM Impact

£57.47

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HP M97596-001 memory module 16 GB DDR5 4800 MHz

£195.34

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HP 5S4C4AA memory module 16 GB 1 x 16 GB DDR5 4800 MHz

£111.97

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Design
Compatible products	Alienware M15 R7 Alienware M15 R7 AMD Alienware M16 (AMD) Alienware M17 R5 Alienware M18 (AMD) Alienware X17 R2 G5 15 (5520) G5 15 (5521) G5 15 (5525) G5 15 (5535) G7 16 (7620) G7 16 (7635) Inspiron 14 7000 (7420) Inspiron 16 7000 (7620) Inspiron 16 7000 (7630) Latitude 5431 Latitude 5440 Latitude 5531 Latitude 5540 Optiplex 7000 Micro OptiPlex 7010 Micro Plus (Launched in 2023) OptiPlex 7410 All-in-One 65W OptiPlex 7410 All-in-One Plus Precision 3470 Precision 3570 Precision 3571 Precision 3580 Precision 3581 Precision 5570 Precision 5770 Precision 7670 Precision 7770 Precision Workstation 3260 Compact Precision Workstation 3260XE Compact Precision Workstation 3460 Small Form Factor Precision Workstation 3460XE Small Form Factor Vostro 16 7000 (7620) XPS 15 (9520) XPS 17 (9720)
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Compatible products	Alienware M15 R7 Alienware M15 R7 AMD Alienware M16 (AMD) Alienware M17 R5 Alienware M18 (AMD) Alienware X17 R2 G5 15 (5520) G5 15 (5521) G5 15 (5525) G5 15 (5535) G7 16 (7620) G7 16 (7635) Inspiron 14 7000 (7420) Inspiron 16 7000 (7620) Inspiron 16 7000 (7630) Latitude 5431 Latitude 5440 Latitude 5531 Latitude 5540 Optiplex 7000 Micro OptiPlex 7010 Micro Plus (Launched in 2023) OptiPlex 7410 All-in-One 65W OptiPlex 7410 All-in-One Plus Precision 3470 Precision 3570 Precision 3571 Precision 3580 Precision 3581 Precision 5570 Precision 5770 Precision 7670 Precision 7770 Precision Workstation 3260 Compact Precision Workstation 3260XE Compact Precision Workstation 3460 Small Form Factor Precision Workstation 3460XE Small Form Factor Vostro 16 7000 (7620) XPS 15 (9520) XPS 17 (9720)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5

DELL SNPVNY72C/16G memory module 16 GB 1 x 16 GB DDR5 4800 MHz

Design
Compatible products	Alienware M15 R7 Alienware M15 R7 AMD Alienware M16 (AMD) Alienware M17 R5 Alienware M18 (AMD) Alienware X17 R2 G5 15 (5520) G5 15 (5521) G5 15 (5525) G5 15 (5535) G7 16 (7620) G7 16 (7635) Inspiron 14 7000 (7420) Inspiron 16 7000 (7620) Inspiron 16 7000 (7630) Latitude 5431 Latitude 5440 Latitude 5531 Latitude 5540 Optiplex 7000 Micro OptiPlex 7010 Micro Plus (Launched in 2023) OptiPlex 7410 All-in-One 65W OptiPlex 7410 All-in-One Plus Precision 3470 Precision 3570 Precision 3571 Precision 3580 Precision 3581 Precision 5570 Precision 5770 Precision 7670 Precision 7770 Precision Workstation 3260 Compact Precision Workstation 3260XE Compact Precision Workstation 3460 Small Form Factor Precision Workstation 3460XE Small Form Factor Vostro 16 7000 (7620) XPS 15 (9520) XPS 17 (9720)
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Compatible products	Alienware M15 R7 Alienware M15 R7 AMD Alienware M16 (AMD) Alienware M17 R5 Alienware M18 (AMD) Alienware X17 R2 G5 15 (5520) G5 15 (5521) G5 15 (5525) G5 15 (5535) G7 16 (7620) G7 16 (7635) Inspiron 14 7000 (7420) Inspiron 16 7000 (7620) Inspiron 16 7000 (7630) Latitude 5431 Latitude 5440 Latitude 5531 Latitude 5540 Optiplex 7000 Micro OptiPlex 7010 Micro Plus (Launched in 2023) OptiPlex 7410 All-in-One 65W OptiPlex 7410 All-in-One Plus Precision 3470 Precision 3570 Precision 3571 Precision 3580 Precision 3581 Precision 5570 Precision 5770 Precision 7670 Precision 7770 Precision Workstation 3260 Compact Precision Workstation 3260XE Compact Precision Workstation 3460 Small Form Factor Precision Workstation 3460XE Small Form Factor Vostro 16 7000 (7620) XPS 15 (9520) XPS 17 (9720)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5

£106.76

RRP £129.01

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Samsung M425R2GA3BB0-CQK memory module 16 GB 1 x 16 GB DDR5 4800 MHz

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Hypertec HP Equivalent 16GB DDR5 4800MHz 1Rx8 Sodimm 262pin

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ADATA Premier memory module 16 GB 1 x 16 GB DDR5 4800 MHz ECC

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Kingston Technology FURY 16GB 5600MT/s DDR5 CL40 SODIMM Impact PnP

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Hypertec Dell Equivalent 16GB DDR5 4800MHz 1Rx8 Sodimm 262pin

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Kingston Technology KTL-TN548T-16G memory module 16 GB 1 x 16 GB DDR5 ECC

£103.43

RRP £131.87

Save £45.68

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Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	8.4 g
Package weight	26.72 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	26.72 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	812.13 g
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	8.4 g
Package weight	26.72 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	26.72 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	812.13 g
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	8.4 g
Package weight	26.72 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	26.72 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	812.13 g
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

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