Name: Corsair Vengeance LPX memory module 64 GB 4 x 16 GB DDR4 3600 MHz
Brand: Corsair
SKU: CMK64GX4M4D3600C18
Price: 240.61 GBP
Availability: OutOfStock

Kingston Technology FURY 64GB 5600MT/s DDR5 ECC Reg CL28 DIMM (Kit of 4) Renegade Pro EXPO

£373.61

RRP £467.01

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Kingston Technology FURY 64GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 4) Renegade Pro EXPO

£401.83

RRP £478.85

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Corsair Vengeance LPX memory module 64 GB 4 x 16 GB DDR4 2666 MHz

£173.66

RRP £225.76

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Corsair Vengeance LPX memory module 64 GB 4 x 16 GB DDR4 3600 MHz

£240.61

RRP £300.76

Save £100.25

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Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	28
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Product colour	Black
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	28
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.1
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Weight & dimensions
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Width	3.8 mm
Depth	133.3 mm
Height	31.2 mm
Weight	72.8 g
Package weight	109.34 g
Packaging data
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Package weight	109.34 g
Logistics data
Master (outer) case width	207 mm
Master (outer) case length	469.9 mm
Master (outer) case height	105.4 mm
Master (outer) case gross weight	1.45 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	28
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Product colour	Black
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	28
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.1
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Weight & dimensions
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Width	3.8 mm
Depth	133.3 mm
Height	31.2 mm
Weight	72.8 g
Package weight	109.34 g
Packaging data
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Package weight	109.34 g
Logistics data
Master (outer) case width	207 mm
Master (outer) case length	469.9 mm
Master (outer) case height	105.4 mm
Master (outer) case gross weight	1.45 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Product colour	Black
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.1
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Weight & dimensions
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Width	3.8 mm
Depth	133.3 mm
Height	31.2 mm
Weight	72.8 g
Package weight	109.34 g
Packaging data
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Package weight	109.34 g
Logistics data
Master (outer) case width	207 mm
Master (outer) case length	469.9 mm
Master (outer) case height	105.4 mm
Master (outer) case gross weight	1.45 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Product colour	Black
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	Yes
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.1
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Weight & dimensions
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Width	3.8 mm
Depth	133.3 mm
Height	31.2 mm
Weight	72.8 g
Package weight	109.34 g
Packaging data
Package width	104.1 mm
Package depth	167.6 mm
Package height	35.6 mm
Package weight	109.34 g
Logistics data
Master (outer) case width	207 mm
Master (outer) case length	469.9 mm
Master (outer) case height	105.4 mm
Master (outer) case gross weight	1.45 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.2 V
Design
Product colour	Black
Cooling type	Heatsink
Certification	Intel XMP 2.0
Technical details
Product colour	Black
Country of origin	China
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Memory clock speed	2666 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Black
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Country of origin	China
Cooling type	Heatsink
Certification	Intel XMP 2.0
Memory clock speed	2666 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Certificates
Certification	Intel XMP 2.0
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	China
Harmonized System (HS) code	84733020

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