Name: Team Group ELITE memory module 32 GB 1 x 32 GB DDR5 4800 MHz
Brand: Team Group
SKU: TED532G4800C4001
Price: 76.22 GBP
Availability: OutOfStock

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Team Group ELITE memory module 32 GB 1 x 32 GB DDR5 4800 MHz

£76.22

RRP £113.07

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Memory
Package type	Tray
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Power
Memory voltage	1.1 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Package type	Tray
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Memory
Package type	Tray
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Power
Memory voltage	1.1 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Package type	Tray
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	6.62 mm
Depth	133.3 mm
Height	34.9 mm
Weight	34.59 g
Package weight	54.1 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	6.62 mm
Depth	133.3 mm
Height	34.9 mm
Weight	34.59 g
Package weight	54.1 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	6.62 mm
Depth	133.3 mm
Height	34.9 mm
Weight	34.59 g
Package weight	54.1 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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