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Memory Modules
-
| Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
Hypertec HYUK421512832GBOE memory module 32 GB 4 x 8 GB DDR4 2133 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
£80.02
£66.68 In stock
-
| Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
Hypertec HYUK424512832GBOE memory module 32 GB 4 x 8 GB DDR4 2400 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Memory form factor | 288-pin DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
£80.02
£66.68 In stock
-
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.2 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 7.2 mm |
| Depth | 133.3 mm |
| Height | 34.1 mm |
| Weight | 134.28 g |
| Package weight | 191.22 g |
| Packaging data |
|---|
| Package width | 95.2 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 191.22 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.12 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL17 DIMM (Kit of 4) Black | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.2 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 7.2 mm |
| Depth | 133.3 mm |
| Height | 34.1 mm |
| Weight | 134.28 g |
| Package weight | 191.22 g |
| Packaging data |
|---|
| Package width | 95.2 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 191.22 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.12 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£142.84
£119.03 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 187.28 g |
| Package weight | 259.33 g |
| Packaging data |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 259.33 g |
| Logistics data |
|---|
| Master (outer) case width | 181.6 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 147.3 mm |
| Master (outer) case gross weight | 2.01 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL17 DIMM (Kit of 4) RGB | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 187.28 g |
| Package weight | 259.33 g |
| Packaging data |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 259.33 g |
| Logistics data |
|---|
| Master (outer) case width | 181.6 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 147.3 mm |
| Master (outer) case gross weight | 2.01 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£103.44
£86.20 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 187.28 g |
| Package weight | 259.33 g |
| Packaging data |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 259.33 g |
| Logistics data |
|---|
| Master (outer) case width | 181.6 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 147.3 mm |
| Master (outer) case gross weight | 2.01 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) RGB | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 187.28 g |
| Package weight | 259.33 g |
| Packaging data |
|---|
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
| Package weight | 259.33 g |
| Logistics data |
|---|
| Master (outer) case width | 181.6 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 147.3 mm |
| Master (outer) case gross weight | 2.01 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£98.15
£81.79 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 205.32 g |
| Package weight | 313.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 313.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.39 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 205.32 g |
| Package weight | 313.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 313.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.39 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£169.01
£140.84 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.29 mm |
| Depth | 133.3 mm |
| Height | 42 mm |
| Weight | 166.8 g |
| Package weight | 285.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 285.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.19 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.29 mm |
| Depth | 133.3 mm |
| Height | 42 mm |
| Weight | 166.8 g |
| Package weight | 285.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 285.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.19 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£84.34
£70.28 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 205.32 g |
| Package weight | 313.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 313.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.39 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.2 mm |
| Depth | 133.3 mm |
| Height | 43 mm |
| Weight | 205.32 g |
| Package weight | 313.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 313.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.39 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£174.25
£145.21 In stock
-
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.29 mm |
| Depth | 133.3 mm |
| Height | 42 mm |
| Weight | 166 g |
| Package weight | 285.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 285.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.19 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Width | 8.29 mm |
| Depth | 133.3 mm |
| Height | 42 mm |
| Weight | 166 g |
| Package weight | 285.67 g |
| Packaging data |
|---|
| Package width | 129.5 mm |
| Package depth | 33 mm |
| Package height | 171.4 mm |
| Package weight | 285.67 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.19 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£152.26
£126.88 In stock
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