Name: Kingston Technology KCP556UD8-48 memory module 48 GB 1 x 48 GB DDR5
Brand: Kingston Technology
SKU: KCP556UD8-48
Price: 152.68 GBP
Availability: InStock

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Kingston Technology KCP556UD8-48 memory module 48 GB 1 x 48 GB DDR5

£152.68

RRP £187.04

Save £59.80

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Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	39.2 mm
Weight	47 g
Package weight	100.13 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	100.13 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.69 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	39.2 mm
Weight	47 g
Package weight	100.13 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	100.13 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.69 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	44 mm
Weight	52 g
Package weight	104.29 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	104.29 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.76 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	44 mm
Weight	52 g
Package weight	104.29 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	104.29 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.76 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 48 GB
Internal memory	48 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	39.2 mm
Weight	47 g
Package weight	100.13 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	100.13 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.69 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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