Name: Kingston Technology FURY 24GB 8000MT/s DDR5 CL38 DIMM Renegade RGB White
Brand: Kingston Technology
SKU: KF580C38RWA-24
Price: 136.55 GBP
Availability: InStock

Kingston Technology FURY 24GB 7200MT/s DDR5 CL38 DIMM Renegade RGB XMP

£121.84

RRP £163.47

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Kingston Technology FURY 24GB 7200MT/s DDR5 CL38 DIMM Renegade Silver XMP

£118.24

RRP £161.59

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Kingston Technology FURY 24GB 8400MT/s DDR5 CL40 CUDIMM Renegade RGB Silver XMP

£156.97

RRP £213.22

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Kingston Technology FURY 24GB 8400MT/s DDR5 CL40 CUDIMM Renegade Silver XMP

£153.84

RRP £220.50

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Kingston Technology FURY 24GB 8400MT/s DDR5 CL40 CUDIMM Renegade White XMP

£153.84

RRP £208.96

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Kingston Technology FURY 24GB 8400MT/s DDR5 CL40 CUDIMM Renegade RGB White XMP

£150.70

RRP £198.42

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Kingston Technology FURY 24GB 8000MT/s DDR5 CL38 DIMM Renegade Silver

£131.83

RRP £180.17

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Kingston Technology FURY 24GB 8000MT/s DDR5 CL38 DIMM Renegade White

£131.83

RRP £173.58

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Kingston Technology FURY 24GB 8800MT/s DDR5 CL42 CUDIMM Renegade Silver

£181.84

RRP £266.70

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Kingston Technology FURY 24GB 8800MT/s DDR5 CL42 CUDIMM Renegade White

£181.84

RRP £256.09

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Kingston Technology FURY 24GB 8000MT/s DDR5 CL38 DIMM Renegade RGB Silver

£136.55

RRP £197.99

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Kingston Technology FURY 24GB 8000MT/s DDR5 CL38 DIMM Renegade RGB White

£136.55

RRP £159.30

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Power
Memory voltage	1.45 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	44 mm
Weight	52.39 g
Package weight	104.29 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	104.29 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.76 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	44 mm
Weight	52.39 g
Package weight	104.29 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	104.29 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.76 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	39.2 mm
Weight	45.2 g
Package weight	100.13 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	100.13 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.69 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	39.2 mm
Weight	45.2 g
Package weight	100.13 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	100.13 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.69 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Clocked unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.45 V
ECC	No
Internal memory type	DDR5
Features
Buffered memory type	Clocked unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.45 V
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR5
Memory data transfer rate	8400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Width	7.66 mm
Depth	133.3 mm
Height	45 mm
Weight	53.1 g
Package weight	106.16 g
Packaging data
Package width	129.5 mm
Package depth	16 mm
Package height	171.4 mm
Package weight	106.16 g
Logistics data
Master (outer) case width	181.6 mm
Master (outer) case length	254 mm
Master (outer) case height	147.3 mm
Master (outer) case gross weight	1.78 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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