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Items 25-27 of 27
Power | |
---|---|
Memory voltage | 1.4 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 86.8 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.4 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 86.8 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £397.67
Power | |
---|---|
Memory voltage | 1.4 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 86.8 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.4 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 86.8 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £316.91
Power | |
---|---|
Memory voltage | 1.35 V |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
ECC | No |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
ECC | No |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Logistics data | |
Harmonized System (HS) code | 84733020 |
Other features | |
Harmonized System (HS) code | 84733020 |
Power | |
---|---|
Memory voltage | 1.35 V |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
ECC | No |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 32 GB |
Internal memory | 128 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
ECC | No |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Logistics data | |
Harmonized System (HS) code | 84733020 |
Other features | |
Harmonized System (HS) code | 84733020 |
Save £303.25
Items 25-27 of 27