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Memory Modules
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Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Compatible products | Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 500 Series,AMD 500 Series,AMD X570,AMD TRX40 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
Technical details |
---|
Country of origin | Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
SPD profile | Yes |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features |
---|
Compatible products | Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 500 Series,AMD 500 Series,AMD X570,AMD TRX40 |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
SPD profile | Yes |
Country of origin | Taiwan |
Cooling type | Heatsink |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Weight & dimensions |
---|
Height | 44 mm |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | Taiwan |
Harmonized System (HS) code | 84733020 |
Corsair Vengeance RGB Pro CMH32GX4M4D3600C18 memory module 32 GB 4 x 8 GB DDR4 3600 MHz Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Compatible products | Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 500 Series,AMD 500 Series,AMD X570,AMD TRX40 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
Technical details |
---|
Country of origin | Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
SPD profile | Yes |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features |
---|
Compatible products | Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 500 Series,AMD 500 Series,AMD X570,AMD TRX40 |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
SPD profile | Yes |
Country of origin | Taiwan |
Cooling type | Heatsink |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Weight & dimensions |
---|
Height | 44 mm |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | Taiwan |
Harmonized System (HS) code | 84733020 |
£190.36
£158.63 In stock
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Power |
---|
Memory voltage | 1.2 V |
Memory |
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Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Memory ranking | 2 |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Memory ranking | 2 |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Weight & dimensions |
---|
Package width | 10 mm |
Package depth | 150 mm |
Package height | 55 mm |
Package weight | 30 g |
Packaging data |
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Package width | 10 mm |
Package depth | 150 mm |
Package height | 55 mm |
Package weight | 30 g |
Hypertec Hyperam 32GB memory module 4 x 8 GB DDR4 Power |
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Memory voltage | 1.2 V |
Memory |
---|
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Memory ranking | 2 |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Memory ranking | 2 |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Weight & dimensions |
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Package width | 10 mm |
Package depth | 150 mm |
Package height | 55 mm |
Package weight | 30 g |
Packaging data |
---|
Package width | 10 mm |
Package depth | 150 mm |
Package height | 55 mm |
Package weight | 30 g |
£89.50
£74.58 In stock
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Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 134.28 g |
Package weight | 191.22 g |
Packaging data |
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Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 191.22 g |
Logistics data |
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Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.12 kg |
Products per master (outer) case | 10 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL17 DIMM (Kit of 4) Black Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 134.28 g |
Package weight | 191.22 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 191.22 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.12 kg |
Products per master (outer) case | 10 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£142.84
£119.03 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 136.68 g |
Package weight | 191.22 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 191.22 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.12 kg |
Products per master (outer) case | 10 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Black Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 136.68 g |
Package weight | 191.22 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 191.22 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.12 kg |
Products per master (outer) case | 10 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£137.59
£114.66 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 187.28 g |
Package weight | 259.33 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 259.33 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.01 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL17 DIMM (Kit of 4) RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 260 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 187.28 g |
Package weight | 259.33 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 259.33 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.01 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£103.44
£86.20 Out of stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 187.28 g |
Package weight | 259.33 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 259.33 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.01 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 187.28 g |
Package weight | 259.33 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 25.4 mm |
Package height | 171.4 mm |
Package weight | 259.33 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.01 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£98.15
£81.79 Out of stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 205.32 g |
Package weight | 313.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 313.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.39 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 205.32 g |
Package weight | 313.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 313.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.39 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£169.01
£140.84 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 166.8 g |
Package weight | 285.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 285.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.19 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 166.8 g |
Package weight | 285.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 285.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.19 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£84.34
£70.28 Out of stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 205.32 g |
Package weight | 313.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 313.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.39 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 205.32 g |
Package weight | 313.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 313.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.39 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£174.25
£145.21 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 166 g |
Package weight | 285.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 285.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.19 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 166 g |
Package weight | 285.67 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 33 mm |
Package height | 171.4 mm |
Package weight | 285.67 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.19 kg |
Products per master (outer) case | 7 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£152.26
£126.88 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/server |
Memory form factor | 240-pin DIMM |
CAS latency | 11 |
Memory voltage | 1.35 V |
Module configuration | 4096M x 72 |
Memory ranking | 4 |
ECC | Yes |
Memory clock speed | 1600 MHz |
Internal memory type | DDR3L |
Features |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/server |
Memory form factor | 240-pin DIMM |
CAS latency | 11 |
Memory voltage | 1.35 V |
Module configuration | 4096M x 72 |
Memory ranking | 4 |
ECC | Yes |
Memory clock speed | 1600 MHz |
Internal memory type | DDR3L |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Weight & dimensions |
---|
Height | 30.4 mm |
Samsung M386B4G70DM0-YK04 memory module 32 GB 4 x 8 GB DDR3L 1600 MHz ECC Power |
---|
Memory voltage | 1.35 V |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/server |
Memory form factor | 240-pin DIMM |
CAS latency | 11 |
Memory voltage | 1.35 V |
Module configuration | 4096M x 72 |
Memory ranking | 4 |
ECC | Yes |
Memory clock speed | 1600 MHz |
Internal memory type | DDR3L |
Features |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 4 x 8 GB |
Internal memory | 32 GB |
Component for | PC/server |
Memory form factor | 240-pin DIMM |
CAS latency | 11 |
Memory voltage | 1.35 V |
Module configuration | 4096M x 72 |
Memory ranking | 4 |
ECC | Yes |
Memory clock speed | 1600 MHz |
Internal memory type | DDR3L |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Weight & dimensions |
---|
Height | 30.4 mm |
£330.55
£275.46 Out of stock
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