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Memory Modules
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 16.6 g |
Package weight | 45.6 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 45.6 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.35 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 16.6 g |
Package weight | 45.6 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 45.6 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.35 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£111.86
£93.22 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 68.34 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Black Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 68.34 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£112.85
£94.04 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 66.74 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL18 DIMM (Kit of 2) Black Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 66.74 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£126.55
£105.46 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 69.52 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Black Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.2 mm |
Depth | 133.3 mm |
Height | 34.1 mm |
Weight | 69.52 g |
Package weight | 96.69 g |
Packaging data |
---|
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 96.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.63 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£113.90
£94.92 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 93.64 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 93.64 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£129.02
£107.52 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 98.04 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 98.04 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£131.06
£109.22 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 93.64 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 32GB 3600MT/s DDR4 CL18 DIMM (Kit of 2) RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 93.64 g |
Package weight | 130.99 g |
Packaging data |
---|
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 130.99 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.16 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£136.91
£114.09 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£163.00
£135.83 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) 2RX8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£124.54
£103.78 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£151.21
£126.01 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 108.38 g |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.55 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 108.38 g |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.55 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£84.34
£70.28 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 82.86 g |
Package type | Box |
Package weight | 143.23 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 16 mm |
Package height | 171.4 mm |
Package type | Box |
Package weight | 143.23 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.34 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£135.49
£112.91 In stock
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