Name: Kingston Technology KSM56T46BD8KM-48HM memory module 48 GB 1 x 48 GB DDR5 5600 MT/s
Brand: Kingston Technology
SKU: KSM56T46BD8KM-48HM
Price: 238.25 GBP
Availability: InStock

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Kingston Technology KSM56T46BD8KM-48HM memory module 48 GB 1 x 48 GB DDR5 5600 MT/s

£238.25

RRP £327.58

Save £129.05

In stock

More Info

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Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Product colour	Black
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.8 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Product colour	Black
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.8 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.2 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	21
Memory voltage	1.2 V
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	21
Memory voltage	1.2 V
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	21
Memory voltage	1.2 V
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	21
Memory voltage	1.2 V
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Weight & dimensions
Width	133.3 mm
Height	31.2 mm

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