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Name: Kingston Technology FURY 64GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP
Brand: Kingston Technology
SKU: KF556S40IBK2-64
Price: 191.53 GBP
Availability: InStock

Kingston Technology FURY 64GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact

£175.66

RRP £204.94

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Kingston Technology FURY 64GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP

£191.53

RRP £261.75

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Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	20 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	20 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	20 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	20 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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