Name: Kingston Technology FURY 32GB 6400MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP
Brand: Kingston Technology
SKU: KF564S38IBK2-32
Price: 123.31 GBP
Availability: InStock

Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact

£101.40

RRP £148.72

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Kingston Technology KCP548SS8K2-32 memory module 32 GB 2 x 16 GB DDR5

£158.11

RRP £222.67

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Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP

£107.32

RRP £135.03

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Kingston Technology FURY 32GB 6000MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP

£122.45

RRP £178.58

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Kingston Technology FURY 32GB 6400MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP

£123.31

RRP £150.03

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Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.8 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)

Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.8 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)

Power
Memory voltage	1.1 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Internal memory type	DDR5
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Internal memory type	DDR5
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	28.56 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.8 g
Package weight	46.21 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

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