Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
FREE SHIPPING ON ALL ORDERS
No Minimum Spend
MONEY BACK GUARANTEE
30 Days Return Policy
24/7 ONLINE SUPPORT
Email Support Available
SECURE PAYMENT
Secured by SSL & 3D V2
Memory Modules
- Home
- PC Components
- Components
- Memory Modules
Memory Modules
Shop By
-
Power Memory voltage 1.1 V Design JEDEC standard Yes Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16.8 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact£101.40Power Memory voltage 1.1 V Design JEDEC standard Yes Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16.8 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) £101.40£84.50RRP £125.06Save £40.56
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Harmonized System (HS) code 84733020 Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Harmonized System (HS) code 84733020 Other features Country of origin China, Taiwan Harmonized System (HS) code 84733020 Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact£55.13Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Harmonized System (HS) code 84733020 Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Harmonized System (HS) code 84733020 Other features Country of origin China, Taiwan Harmonized System (HS) code 84733020 £55.13£45.94RRP £72.59Save £26.65
Out of stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8.4 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM Impact£57.47Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8.4 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £57.47£47.89RRP £74.72Save £26.82
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 2 ECC No Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 10 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM Impact£96.41Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 2 ECC No Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 10 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £96.41£80.34RRP £134.17Save £53.83
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 20 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 64GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact£175.66Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 20 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £175.66£146.38RRP £235.68Save £89.29
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Harmonized System (HS) code 84733020 Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Harmonized System (HS) code 84733020 Other features Country of origin China, Taiwan Harmonized System (HS) code 84733020 Kingston Technology FURY 8GB 4800MT/s DDR5 CL38 SODIMM Impact£32.10Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 38 Memory voltage 1.1 V Lead plating Gold Module configuration 1024M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 29.12 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Harmonized System (HS) code 84733020 Memory data transfer rate 4800 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Harmonized System (HS) code 84733020 Other features Country of origin China, Taiwan Harmonized System (HS) code 84733020 £32.10£26.75RRP £44.94Save £18.19
In stock -
Power Memory voltage 1.1 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Harmonized System (HS) code 84733020 Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020 Kingston Technology KCP548SS6-8 memory module 8 GB 1 x 8 GB DDR5£39.96Power Memory voltage 1.1 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Harmonized System (HS) code 84733020 Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020 £39.96£33.30RRP £59.94Save £26.64
In stock -
Power Memory voltage 1.1 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Harmonized System (HS) code 84733020 Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020 Kingston Technology KCP548SS8K2-32 memory module 32 GB 2 x 16 GB DDR5£158.11Power Memory voltage 1.1 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Memory ranking 1 ECC No Internal memory type DDR5 Harmonized System (HS) code 84733020 Logistics data Harmonized System (HS) code 84733020 Other features Harmonized System (HS) code 84733020 £158.11£131.76RRP £195.00Save £63.24
Out of stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16.8 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP£107.32Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 16.8 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £107.32£89.43RRP £127.88Save £38.45
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 10 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM Impact PnP£92.27Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 10 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £92.27£76.89RRP £134.56Save £57.67
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 20 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 64GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP£191.53Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 2 x 32 GB Internal memory 64 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 4096M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 2 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 20 g Package weight 46.21 g Packaging data Package width 95.2 mm Package depth 14 mm Package height 171.4 mm Package weight 46.21 g Logistics data Master (outer) case width 203.2 mm Master (outer) case length 311.1 mm Master (outer) case height 101.6 mm Master (outer) case gross weight 1.37 kg Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £191.53£159.61RRP £253.77Save £94.17
In stock -
Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8.4 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan Kingston Technology FURY 16GB 5600MT/s DDR5 CL40 SODIMM Impact PnP£56.40Power Memory voltage 1.1 V Design Cooling type Heatsink JEDEC standard Yes Technical details Country of origin China, Taiwan Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V Features On-Die ECC Yes Buffered memory type Unregistered (unbuffered) Intel Extreme Memory Profile (XMP) Yes Intel Extreme Memory Profile (XMP) version 3.0 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 262-pin SO-DIMM CAS latency 40 Memory voltage 1.1 V Lead plating Gold Module configuration 2048M x 64 Row cycle time 48 ns Refresh row cycle time 295 ns Row active time 28.56 ns SPD profile Yes Country of origin China, Taiwan Cooling type Heatsink Memory ranking 1 ECC No Internal memory type DDR5 Programming power voltage (VPP) 1.8 V JEDEC standard Yes Memory data transfer rate 5600 MT/s Operational conditions Operating temperature (T-T) 0 - 85 °C Storage temperature (T-T) -55 - 100 °C Weight & dimensions Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Width 3.8 mm Depth 69.6 mm Height 30 mm Weight 8.4 g Package weight 26.72 g Packaging data Package width 57.1 mm Package depth 14 mm Package height 171.4 mm Package weight 26.72 g Logistics data Master (outer) case width 196.8 mm Master (outer) case length 311.1 mm Master (outer) case height 61 mm Master (outer) case gross weight 812.13 g Products per master (outer) case 25 pc(s) Other features Country of origin China, Taiwan £56.40£47.00RRP £83.66Save £36.66
In stock
Shop By
x
Shopping Options Manufacturer
Price
Stock
ECC
Memory form factor
Internal memory
Memory layout (modules x size)
My Wish List
Best Selling Product
