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Memory Modules
-
Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 4800MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro PnP Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory channels | Octa-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,239.25
£1,032.71RRP £1,755.61Save £722.90
In stock
-
Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL36 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £1,662.55Save £546.75
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 41.43 g |
Package weight | 570.54 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Package weight | 570.54 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 146.1 mm |
Master (outer) case gross weight | 1.9 kg |
Products per master (outer) case | 3 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade Black Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Width | 8.29 mm |
Depth | 133.3 mm |
Height | 42 mm |
Weight | 41.43 g |
Package weight | 570.54 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Package weight | 570.54 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 146.1 mm |
Master (outer) case gross weight | 1.9 kg |
Products per master (outer) case | 3 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£943.46
£786.22RRP £1,116.43Save £330.21
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 54.19 g |
Package weight | 626.54 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Package weight | 626.54 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 146.1 mm |
Master (outer) case gross weight | 2.07 kg |
Products per master (outer) case | 3 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade RGB Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
On-Die ECC | No |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Width | 8.2 mm |
Depth | 133.3 mm |
Height | 43 mm |
Weight | 54.19 g |
Package weight | 626.54 g |
Packaging data |
---|
Package width | 129.5 mm |
Package depth | 73.7 mm |
Package height | 171.4 mm |
Package weight | 626.54 g |
Logistics data |
---|
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 146.1 mm |
Master (outer) case gross weight | 2.07 kg |
Products per master (outer) case | 3 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£987.08
£822.57RRP £1,266.76Save £444.19
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 4096M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £1,925.38Save £714.45
In stock
-
Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL28 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.25 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 28 |
Memory voltage | 1.25 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,338.97
£1,115.81RRP £1,997.29Save £881.49
In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,453.12
£1,210.93RRP £2,179.67Save £968.74
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,601.78
£1,334.82RRP £1,962.19Save £627.37
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£1,601.78
£1,334.82RRP £2,175.76Save £840.94
In stock
-
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
---|
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
---|
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
---|
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6800MT/s DDR5 ECC Reg CL34 DIMM (Kit of 8) Renegade Pro XMP Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability compliance | Yes |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory |
---|
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | Yes |
Internal memory type | DDR5 |
Features |
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On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 8 x 32 GB |
Internal memory | 256 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 34 |
Memory voltage | 1.4 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | Yes |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6800 MT/s |
Operational conditions |
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Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability |
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Sustainability compliance | Yes |
Doesn't contain | Halogen |
Weight & dimensions |
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Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 3.8 mm |
Depth | 133.3 mm |
Height | 31.2 mm |
Weight | 173.6 g |
Package weight | 190.51 g |
Packaging data |
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Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 190.51 g |
Logistics data |
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Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 2.21 kg |
Products per master (outer) case | 10 pc(s) |
Other features |
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Country of origin | China, Taiwan |
£1,885.97
£1,571.64RRP £2,200.30Save £628.66
In stock
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