Name: Xilence XC998 computer cooling system Processor Liquid cooling kit 12 cm White 1 pc(s)
Brand: Xilence
SKU: XC998
Price: 126.3 GBP
Availability: InStock

Xilence LiQuRizer RGB XC982 Processor Liquid cooling kit 12 cm Black

£95.05

RRP £128.31

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Xilence XC997 computer cooling system Processor Liquid cooling kit 12 cm Black 1 pc(s)

£124.99

RRP £185.40

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Xilence XC998 computer cooling system Processor Liquid cooling kit 12 cm White 1 pc(s)

£126.30

RRP £178.92

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Performance
Suitable location	Processor
Rotational speed (min)	500 RPM
Rotational speed (max)	1500 RPM
Thermal Design Power (TDP)	300 W
Noise level (low speed)	22 dB
Noise level (high speed)	25 dB
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 2011 (Socket R), LGA 2066, Socket AM4, Socket AM5
Minimum airflow (imperial)	63.41 cfm
Pump connector	3-pin
Fan bearing technology	Fluid Dynamic Bearing (FDB)
Pump bearing technology	Ceramic bearing
Pump motor speed	2100 RPM
Fan static pressure	1.58 mmH2O
Design
Material	Aluminium, Copper, Plastic
Illumination colour	Multi
Product colour	Black
Illumination LED	Yes
Radiator material	Aluminum
Base plate material	Copper
Technical details
Thermal Design Power (TDP)	300 W
Noise level (low speed)	22 dB
Noise level (high speed)	25 dB
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 2011 (Socket R), LGA 2066, Socket AM4, Socket AM5
Minimum airflow (imperial)	63.41 cfm
Material	Aluminium, Copper, Plastic
Illumination LED	Yes
Ports & interfaces
Pump connector	3-pin
Power
Thermal Design Power (TDP)	300 W
Pump current	0.36 mA
Fan current	0.2 A
Colour
Product colour	Black
Weight & dimensions
Width	274 mm
Depth	120 mm
Height	27 mm
Weight	2 kg
Radiator width	27 cm
Radiator depth	12 cm
Radiator height	2.7 cm
VRM fan diameter	12 cm
Tube length	40 cm
Waterblock width	7.2 cm
Waterblock depth	7.2 cm
Waterblock height	5.35 cm
Indication
Illumination colour	Multi
Other features
Pump connector	3-pin

Performance
Suitable location	Processor
Rotational speed (min)	500 RPM
Rotational speed (max)	1500 RPM
Thermal Design Power (TDP)	300 W
Noise level (low speed)	22 dB
Noise level (high speed)	25 dB
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 2011 (Socket R), LGA 2066, Socket AM4, Socket AM5
Minimum airflow (imperial)	63.41 cfm
Pump connector	3-pin
Fan bearing technology	Fluid Dynamic Bearing (FDB)
Pump bearing technology	Ceramic bearing
Pump motor speed	2100 RPM
Fan static pressure	1.58 mmH2O
Design
Material	Aluminium, Copper, Plastic
Illumination colour	Multi
Product colour	Black
Illumination LED	Yes
Radiator material	Aluminum
Base plate material	Copper
Technical details
Thermal Design Power (TDP)	300 W
Noise level (low speed)	22 dB
Noise level (high speed)	25 dB
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 2011 (Socket R), LGA 2066, Socket AM4, Socket AM5
Minimum airflow (imperial)	63.41 cfm
Material	Aluminium, Copper, Plastic
Illumination LED	Yes
Ports & interfaces
Pump connector	3-pin
Power
Thermal Design Power (TDP)	300 W
Pump current	0.36 mA
Fan current	0.2 A
Colour
Product colour	Black
Weight & dimensions
Width	274 mm
Depth	120 mm
Height	27 mm
Weight	2 kg
Radiator width	27 cm
Radiator depth	12 cm
Radiator height	2.7 cm
VRM fan diameter	12 cm
Tube length	40 cm
Waterblock width	7.2 cm
Waterblock depth	7.2 cm
Waterblock height	5.35 cm
Indication
Illumination colour	Multi
Other features
Pump connector	3-pin

Performance
Suitable location	Processor
Bearing type	Ceramic bearing
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Quantity per pack	1 pc(s)
Pump connector	3-pin
Fan noise level (min)	18 dB
Fan noise level (max)	28 dB
Pump noise level	28 dB
Pump motor speed	2400 RPM
Design
Product colour	Black
Radiator material	Aluminum
Base plate material	Copper
Technical details
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Ports & interfaces
Pump connector	3-pin
Power
Thermal Design Power (TDP)	350 W
Colour
Product colour	Black
Weight & dimensions
Weight	1.8 kg
Radiator width	39.7 cm
Radiator depth	12 cm
Radiator height	2.7 cm
Waterblock width	7.2 cm
Waterblock depth	7.2 cm
Waterblock height	5.4 cm
Other features
Pump connector	3-pin

Performance
Suitable location	Processor
Bearing type	Ceramic bearing
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Quantity per pack	1 pc(s)
Pump connector	3-pin
Fan noise level (min)	18 dB
Fan noise level (max)	28 dB
Pump noise level	28 dB
Pump motor speed	2400 RPM
Design
Product colour	Black
Radiator material	Aluminum
Base plate material	Copper
Technical details
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Ports & interfaces
Pump connector	3-pin
Power
Thermal Design Power (TDP)	350 W
Colour
Product colour	Black
Weight & dimensions
Weight	1.8 kg
Radiator width	39.7 cm
Radiator depth	12 cm
Radiator height	2.7 cm
Waterblock width	7.2 cm
Waterblock depth	7.2 cm
Waterblock height	5.4 cm
Other features
Pump connector	3-pin

Performance
Suitable location	Processor
Bearing type	Ceramic bearing
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Quantity per pack	1 pc(s)
Pump connector	3-pin
Fan noise level (min)	18 dB
Fan noise level (max)	28 dB
Pump noise level	28 dB
Pump motor speed	2400 RPM
Design
Product colour	White
Radiator material	Aluminum
Base plate material	Copper
Technical details
Thermal Design Power (TDP)	350 W
Type	Liquid cooling kit
Fan diameter	12 cm
Supported processor sockets	Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 1851, Socket AM4, Socket AM5
Airflow	76 m³/h
Ports & interfaces
Pump connector	3-pin
Power
Thermal Design Power (TDP)	350 W
Colour
Product colour	White
Weight & dimensions
Weight	1.8 kg
Radiator width	39.7 cm
Radiator depth	12 cm
Radiator height	2.7 cm
Waterblock width	7.2 cm
Waterblock depth	7.2 cm
Waterblock height	5.4 cm
Other features
Pump connector	3-pin

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